Effect of Zinc Addition on the Evolution of Interfacial Intermetallic Phases at Near-Eutectic 50In-50Sn/Cu Interfaces

In this study, tin-bismuth-silver-indium (Sn-Bi-Ag-In) lead-free solder powders are prepared by the consumable-electrode direct current arc (CDCA) method. Without agglomeration, the satellite-free solder powders show good sphericity. The effect of solder powder sizes on the wettability and microstructure of Sn-Bi-Ag-In solder alloy on copper substrate is systematically investigated. The solder joints prepared by solder powder in a size of 53–120 μm exhibit relatively small wetting angles. In addition, the microstructure of the solder joints is composed of bismuth-rich phases, tin-rich phases, and Ag3Sn phases. A continuous intermetallic compound (IMC) layer with a thickness in the range of 0.64–0.70 μm is formed at the interface between the solder and the copper substrate. The results show that the formation and morphology variety of the IMC layers for different solder joints are unobvious, reflecting the good wettability of the Sn-Bi-Ag-In lead-free solder powders on the copper substrate in a wide size range.

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Effect of Zinc Addition on the Evolution of Interfacial Intermetallic Phases at Near-Eutectic 50In-50Sn/Cu Interfaces

Cited by 2 publications

References 24 publications

Role of the Aging Treatment in the Microstructure Evolution and Mechanical Properties of Cu/Sn-Bi-Ag-In/Cu Joint

Role of the Aging Treatment in the Microstructure Evolution and Mechanical Properties of Cu/Sn-Bi-Ag-In/Cu Joint

Effect of the Solder Powder Size of Sn-Bi-Ag-In Lead-Free Solder on the Wettability and Microstructure of Cu Substrate

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