2017
DOI: 10.1080/00084433.2017.1403073
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Effect of Zn addition on corrosion resistance of Cu-10Ni alloy in clean and sulphide contaminated seawater

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Cited by 2 publications
(6 citation statements)
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“…[1,20,26] Due to the existence of Cl − in the solution, the Cu in the matrix is preferentially dissolved and redeposited to form Cu 2 O, as the reaction process shown in formulae (8) and T A B L E 3 Fitting parameters of electrochemical impedance spectroscopy of 90/10 copper-nickel alloy with different Fe content in 3.5% NaCl solution after corrosion for 1 month (9). [27,28] Cu 2 (OH) 3 Cl is formed by the reaction between thickening Cu 2 O film and adsorbed Cl − , as shown in formula (10). [29] It is revealed in the literature that paratacamite is the most stable of the two isomers of Cu 2 (OH) 3 Cl.…”
Section: Characterization Of the Corrosion Product Filmmentioning
confidence: 99%
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“…[1,20,26] Due to the existence of Cl − in the solution, the Cu in the matrix is preferentially dissolved and redeposited to form Cu 2 O, as the reaction process shown in formulae (8) and T A B L E 3 Fitting parameters of electrochemical impedance spectroscopy of 90/10 copper-nickel alloy with different Fe content in 3.5% NaCl solution after corrosion for 1 month (9). [27,28] Cu 2 (OH) 3 Cl is formed by the reaction between thickening Cu 2 O film and adsorbed Cl − , as shown in formula (10). [29] It is revealed in the literature that paratacamite is the most stable of the two isomers of Cu 2 (OH) 3 Cl.…”
Section: Characterization Of the Corrosion Product Filmmentioning
confidence: 99%
“…Cu 2 O is easy to react with Cl − from solution to form Cu 2 (OH) 3 Cl. The reaction process is shown in formulae (8)(9)(10). According to previous studies [34,35] and the point defect model (PDM), Cu 2 O film is a nonstoichiometric P-type semiconductor membrane with lots of cationic vacancies (V′ Cu ).…”
Section: Analysis Of Corrosion Mechanismmentioning
confidence: 99%
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