Effect of Zn concentration on the interfacial reactions between Sn–3.0Ag–0.5Cu solder and electroplated Cu–xZn wetting layers (x = 0–43 wt%)

Park, Jae Yong; Kim, Young Min; Kim, Young‐Ho

doi:10.1007/s10854-016-4510-9

Cited by 5 publications

(5 citation statements)

References 26 publications

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“…Detailed morphological analysis (of the incorporated TiO 2 nanoparticles) is crucial in order to develop further the SAC305-TiO 2 composite solder alloy. Currently, conventional chemical etching methods are being widely used, involving etching agents such as a mixture of nitric acid/alcohol [9], HCl [12], and NHO 3 [13]. Other etching methods conducted on the SAC305 utilized the ion beam milling from a rapid etching system [14].…”

Section: Introductionmentioning

confidence: 99%

Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO₂ composite solder alloy after selective electrochemical etching

Yahaya

Nazeri

Kheawhom

et al. 2020

Mater. Res. Express

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This work aims to provide deep morphological observation on the incorporated TiO 2 nanoparticles within the SAC305 by selective electrochemical etching. Cyclic voltammetry and chronoamperometry were used to investigate the selective etching performances. The removal of β-Sn matrix was conducted at a fixed potential of −350 mV. Average performances of 2.19 and 2.30 mA were attained from the chronoamperometry. The efficiency of β-Sn removal was approved according to the reduction of the intensities on the phase analysis. Successful observation of the TiO 2 near the Cu 6 Sn 5 layer was attained for an optimum duration of 120 s. Clusters of TiO 2 nanoparticles were entrapped by Cu 6 Sn 5 and Ag 3 Sn intermetallic compound (IMC) layer network and at the solder/substrate interface. The presence of TiO 2 nanoparticles at the solder interface suppresses the growth of the Cu 6 Sn 5 IMC layer. The absence of a β-Sn matrix also allowed in-depth morphological observations to be made of the shape and size of the Cu 6 Sn 5 and Ag 3 Sn. It was found that TiO 2 content facilitates the β-Sn removal, which allows better observation of the IMC phases as well as the TiO 2 reinforcement particles.

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Section: Introductionmentioning

confidence: 99%

Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO₂ composite solder alloy after selective electrochemical etching

Yahaya

Nazeri

Kheawhom

et al. 2020

Mater. Res. Express

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“…The thickness of IMC layer increased with aging time, however, an IMC layer which was too thick would deteriorate the mechanical properties of the soldered joint since the IMC is hard and brittle [17]. It was reported that Sn-Zn series solder possess favourable mechanical properties compared with Cu 6 Sn 5 /Cu 3 Sn IMC layer in Sn-Ag-Cu and Sn-Cu series solder [18]. The compositions of IMC layer in Sn-Zn series soldered joint could be determined as Cu5Zn8 after soldering [16].…”

Section: Introductionmentioning

confidence: 99%

“…The thickness of IMC layer increased with aging time, however, an IMC layer which was too thick would deteriorate the mechanical properties of the soldered joint since the IMC is hard and brittle [17]. It was reported that Sn-Zn series solder possess favourable mechanical properties compared with Cu6Sn5/Cu3Sn IMC layer in Sn-Ag-Cu and Sn-Cu series solder [18]. Figure 2 showed the morphology of IMC layer in Sn-Zn-Ga-Nd solder at different aging time, the results indicated that in Figure 2a,b the thickness of IMC layer increased with aging time, while in Figure 2c,d the compositions of the IMC layer transformed into a mixture of Cu-Sn-Zn compounds.…”

Section: Introductionmentioning

confidence: 99%

Tin Whisker Growth Inhibition in RE-Doped Sn-Zn Soldered Joints

Xue

Liang

et al. 2019

Applied Sciences

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The tin whisker inhibition in RE-doped Sn-Zn soldered joints was investigated. The results indicated that after aging treatment at 150 • C, with the proper addition ratio of Ga and Nd, no obvious NdSn 3 phase nor tin whisker growth was observed in the soldered joints. By replacing the Sn-Nd phase with a Ga-Nd phase, the risk of tin whisker growth caused by the oxidation of RE-phase was significantly inhibited even in soldered joints with additional excessive contents of Nd. The IMC layer in soldered joints with optimal addition showed a relatively regular shape after aging treatment, making the soldered joint maintain preferable mechanical performance. The results would be available for guiding the study of tin whisker growth inhibition method.bearing rare earth Nd were investigated. The results could provide a feasible method to inhibit tin whisker growth, and the method has been successfully tested over a long time aging treatment. Experimental ProcedureAll alloys were made from pure Sn (99.95 wt.%), pure Zn (99.95 wt.%), pure Ga (99.95 wt.%), and pure Nd (99.5 wt.%). Under vacuum atmosphere (10-3 torr), Sn-5Nd master alloy ingots were prepared by melting Sn and Nd at 90 • C for 15 min. Then the master alloy was added into the melted SnZn alloy which was held for about 5 min while mechanical stirring was performed every 1 min. The melting temperature was controlled below 400 • C. The melted solder was chilled to cast and cut into solder bars of 40 mm length. The compositions of alloys were analyzed by inductively coupled plasma emission spectrometer (ICP-AES).The interfacial microstructure of soldered joints after aging treatment were observed by Su8010 field emission scanning electron microscope (FE-SEM, BSE mode, Hitachi Co., Ltd., Tykyo, Japan) equipped with energy dispersive X-ray spectroscopy (EDS). Phase composition analysis was determined through Rigaku ultima IV x-ray diffractometer (XRD) with following parameters: Cu-Kα target, working voltage 40 kV, operating current 40 mA, scanning speed 5 • /min, and scanning range 20 • to 100 • .According to the Japan Industry Standard JIS Z 3198-2 test methods for lead-free solders-Part7

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“…2 To obtain a high quality metallic alloy by controlling the activity of the nobler ion in the solution and then approaching copper and zinc reduction potentials, complexing agents such as cyanides can be added. 3 However, this kind of electrolyte operates at high current densities, meaning that zinc contents are systematically excessive and thus that the types of alloys produced are limited. 4 Moreover, as cyanide-based baths reveal many concerns as to their biological toxicity, an extensive search for satisfactory alternative electrolytes has been stimulated as follows: Pyrophosphate, 5 EDTA, 6 Sorbitol, 7 Nitrilotriacetic, 8 Pentadecafluorooctanoic acid, 9 Sulfate, 10 Glycine 4,11 Tartrate, 12 D-mannitol, 13 Choline acetate, 14 Ammonia solution, 15 Choline chloride, 16 Pyrophosphate-oxalate, 17 Triethanolamine, 18 Gluconate-Sulfate, 19 Glycerol-zincate, 20 Glucoheptonate, 21 Ionic liquid baths.…”

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confidence: 99%

“…4 Furthermore, some deposits have shown poor adherence, unusual colors, 23 multiple cracks, containing pure copper phases, copper and zinc oxides or hydroxides. 3,20,24 Among them, citrate baths appear to be the more likely. Non-toxic, forming stable complexes with several metals such as low molecular mass ligands, 10 citrates also result in waste that is easy to handle.…”

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confidence: 99%

CuZn Electrodeposition in Cyanide-Free Electrolytes: Influence of Citrate/Metal ratio and pH on Simultaneous Copper and Zinc Reduction Kinetics and Alloy Composition Control

Dridi¹,

Dhouibi²,

Hihn³

et al. 2020

J. Electrochem. Soc.

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An experimental and theoretical study of CuZn electroplating mechanisms is conducted in trisodium citrate baths. The study aims to evaluate the influence of different bath parameters: ligand concentration, pH, metal complexation behaviors and solution ionic strength on bath stability and, if applicable, co-reduction processes. UV–VIS spectrophotometry, studies of current polarization curves for copper–zinc deposition, and speciation diagrams of copper in aqueous citrate solutions are incorporated to review the role of the blocking agent and pH on co-reduction ability issues. The CuZn electroplating process is also investigated using LSV curves in different baths, while focus is placed on the rate of metal ion diffusion to the growing centers. Following which, an optimized bath, based on control of the species of the blocking intermediates, is selected and investigated to check CuZn reduction potential rapprochement. Finally, deposition behaviors of copper, zinc and both combined are investigated to correlate deposition kinetics and efficiency to deposit properties (thickness/element content). Chronocoulometric curves of different CuZn deposits combined with their deconvoluted potentiodynamic dissolution peaks are used. Hull cell tests are performed to evaluate current control on a large range of CuZn coatings. Deposit properties are studied using X-ray fluorescence spectrometry.

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Effect of Zn concentration on the interfacial reactions between Sn–3.0Ag–0.5Cu solder and electroplated Cu–xZn wetting layers (x = 0–43 wt%)

Cited by 5 publications

References 26 publications

Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO₂ composite solder alloy after selective electrochemical etching

Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO₂ composite solder alloy after selective electrochemical etching

Tin Whisker Growth Inhibition in RE-Doped Sn-Zn Soldered Joints

CuZn Electrodeposition in Cyanide-Free Electrolytes: Influence of Citrate/Metal ratio and pH on Simultaneous Copper and Zinc Reduction Kinetics and Alloy Composition Control

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Effect of Zn concentration on the interfacial reactions between Sn–3.0Ag–0.5Cu solder and electroplated Cu–xZn wetting layers (x = 0–43 wt%)

Cited by 5 publications

References 26 publications

Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching

Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching

Tin Whisker Growth Inhibition in RE-Doped Sn-Zn Soldered Joints

CuZn Electrodeposition in Cyanide-Free Electrolytes: Influence of Citrate/Metal ratio and pH on Simultaneous Copper and Zinc Reduction Kinetics and Alloy Composition Control

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Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO₂ composite solder alloy after selective electrochemical etching

Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO₂ composite solder alloy after selective electrochemical etching