Effect of [Zn2+]/[Cu2+] ratio of the bath on the composition and property of Cu–Zn alloy micropillars prepared using microanode-guided electroplating

Wang, Chun-Yao; Tseng, Yao-Tien; Lin, Jui-Chang; Ciou, Yong-Jie; Hwang, Yean Ren

doi:10.1016/j.electacta.2021.137969

Cited by 6 publications

(4 citation statements)

References 42 publications

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“…In practical applications, Cu-Zn electroplating is often applied in imitation gold electroplating, and the Zn content of the coating is about 70%. Dimitrov et al believe that the content of the Zn element in a Cu-Zn coating should be above 60 at% to obtain high-quality nanoporous copper [ 15 ]. Therefore, in order to obtain a high-Zn precursor alloy layer, the traditional Cu-Zn electroplating solution formula needs to be optimized.…”

Section: Introductionmentioning

confidence: 99%

A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy

Wang,

et al. 2024

Nanomaterials

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Nanoporous Cu foam is widely applied in many fields such as the packaging of electronic power devices. In this study, a sandwich-structured Cu-Zn eutectic alloy precursor composed of Cu0.53Zn0.47/Cu5Zn8/Cu0.53Zn0.47 is prepared through electroplating. The surface layer of the precursor, Cu0.53Zn0.47, has a flat surface with numerous grain boundaries, which effectively promotes its dealloying behavior. By contrast, Cu5Zn8 has a porous structure, which promotes the dealloying behavior at the center of the precursor. The dealloying of Cu0.53Zn0.47 is dominated by the coherent surface diffusion of Cu atoms, and the crystal lattice and orientation show no changes before and after dealloying. By contrast, the dealloying behavior of Cu5Zn8 requires the renucleation of Cu crystals; in this process, Cu atoms are transported to the surface of the layer by capillary forces to form clusters, which nucleate and grow.

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Section: Introductionmentioning

confidence: 99%

A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy

Wang,

et al. 2024

Nanomaterials

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“…[18,19] Indeed, compared with the methods mentioned earlier, the electrochemical additive manufacturing stands out with its advantages of high precision, ability to process complex structures, low energy consumption and simple process, and has become the mainstream method for processing micrometal components. [20][21][22][23][24][25] Kwon et al fabricated re-entrant structures by a multistep process of laser ablation, coating of insulating material, removal of a part of the insulating material, metal deposition, and removal of the rest of the insulation. [26] As a traditional maskbased electrochemical deposition technology, many noxious chemicals and complicated steps are involved in Kwon's method.…”

Section: Introductionmentioning

confidence: 99%

Simulation and Experiment of Localized Electrochemical Deposition with Re‐Entrant Structures by Applying the Tip Effect

Zou

Ren

et al. 2022

Adv Eng Mater

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Re‐entrant structures on the metallic surface play an essential role in the surface properties of materials. However, low efficiency in the preparation of such structures decreases their presence in different application areas. Herein, a new method of localized electrochemical deposition (LECD) manufacturing of re‐entrant structures by applying the tip effect (TE) is introduced. Thanks to this method, manufacturing complex re‐entrant structures can be realized rapidly and efficiently by a simple process without any external control. First, electrochemical measurement methods are used to analyze the copper electrodeposition mechanism, and then a simulation software is adopted to simulate this method. The simulation results suggest that the deposition velocity of the four edges on the copper microcolumn is faster than that of the other position, which means that applying TE makes it feasible to prepare re‐entrant structures by localized electrodeposition. Moreover, experimental results show that the deposition potential of −0.70 V and the deposition time of 900 s are the optimal parameter combinations to obtain the best re‐entrant structures. In addition, the volumetric deposition rate of a single re‐entrant structure can reach 924.8 μm3 s−1. This method provides an opportunity for large‐area manufacturing of re‐entrant structures and lays the foundation for future applications.

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“…11,12 The potentiostatic localized electrochemical deposition (LECD) process being used for fabrication of Cu/Zn alloy micropillars has been reported, and the control range of surface morphology and alloy composition depending on changing different proportions of the solution. 13 Recently, the electrodeposition of Co-based binary alloys, such as Co/Fe, 14 Co/Ni, 15 and Co/Cu, 16 has been extensively studied. Co/ Cu alloy are classified as nonferrous materials and possess better mechanical properties and excellent magnetic properties over pure copper and pure cobalt under ambient conditions.…”

mentioning

confidence: 99%

“…And the previous work to obtain different composition of alloys is realized by the preparation of different solution component. 13,21 Meniscus-confined electrodeposition (MCED) as a 3D printed technique, has the ability to deposit alloy wires with low surface roughness and controllable compositions in a single electrolyte. So the MCED printing process can be used as a powerful method to fabricate alloy structure for novel microdevices and microsystems.…”

mentioning

confidence: 99%

The Composition and Magnetic Property of Co/Cu Alloy Microwires Prepared Using Meniscus-Confined Electrodeposition: Effect of [Co²⁺], [Cu²⁺] Concentration at the Tip of the Meniscus

Lei

Zhang

Nie

et al. 2021

J. Electrochem. Soc.

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Meniscus-confined electrodeposition (MCED) is an effective and versatile technique for fabrication of alloy structures with precise localization and high controllability. Here, the fabrication of cobalt-copper (Co/Cu) alloy microwires using MCED techniques is reported. Co/Cu microwires with a wide range of compositions (Co9Cu91 to Co100Cu0) and controllable morphology were printed using the co-electrodeposition mode from a single electrolyte. We utilized multiphysics finite element simulation to investigate the influence of electrolyte evaporation and electric field on the concentration distribution of metal ions in the meniscus. The concentration of ions at the substrate interface increases linearly with decreasing humidity and increasing current density, which can be used to fine turn the alloy composition. By further analyzing the alloy composition, we found that the electrodeposition of Cu is diffusion controlled, while Co is mainly electrochemical reaction controlled, as a results of combined action of surface evaporation and reaction dynamics in the meniscus. The prepared alloy wires are polycrystalline, dense and uniform composition distribution. The coercivity and magnetic anisotropy are enhanced by increasing of the copper content in the alloy wires. The high tunability of composition make this alloy a promising material for magnetic micro/nano-electromechanical devices.

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Effect of [Zn2+]/[Cu2+] ratio of the bath on the composition and property of Cu–Zn alloy micropillars prepared using microanode-guided electroplating

Cited by 6 publications

References 42 publications

A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy

A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy

Simulation and Experiment of Localized Electrochemical Deposition with Re‐Entrant Structures by Applying the Tip Effect

The Composition and Magnetic Property of Co/Cu Alloy Microwires Prepared Using Meniscus-Confined Electrodeposition: Effect of [Co²⁺], [Cu²⁺] Concentration at the Tip of the Meniscus

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Effect of [Zn2+]/[Cu2+] ratio of the bath on the composition and property of Cu–Zn alloy micropillars prepared using microanode-guided electroplating

Cited by 6 publications

References 42 publications

A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy

A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy

Simulation and Experiment of Localized Electrochemical Deposition with Re‐Entrant Structures by Applying the Tip Effect

The Composition and Magnetic Property of Co/Cu Alloy Microwires Prepared Using Meniscus-Confined Electrodeposition: Effect of [Co2+], [Cu2+] Concentration at the Tip of the Meniscus

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The Composition and Magnetic Property of Co/Cu Alloy Microwires Prepared Using Meniscus-Confined Electrodeposition: Effect of [Co²⁺], [Cu²⁺] Concentration at the Tip of the Meniscus