Effect to the Surface Composition in Ultrasonic Vibration-Assisted Grinding of BK7 Optical Glass

Zhao, Pei Yi; Zhou, Ming; Liu, Xian Li; Jiang, Bin

doi:10.3390/app10020516

Cited by 13 publications

(5 citation statements)

References 35 publications

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“…These mechanisms improve the ductile machinability of silica glass at high temperature. In addition, Zhao et al [18] carried out the experiments of ultrasonic vibration-assisted grinding of BK7 optical glass. The introduction of ultrasonic vibration highly restrained the brittle removal mode, and increased the proportion of ductile removal mode.…”

Section: Introductionmentioning

confidence: 99%

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Zhang¹,

Yao

Li³

et al. 2022

Preprint

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Prolonged polishing deteriorates the shape accuracy of an optical element and reduces production efficiency simultaneously. In order to reduce the amount of polishing and polishing time, even obtain polish-free fine surfaces, a cerium oxide (CeO2) slurry assisted grinding (SAG) is investigated. A novel theoretical model was established to predict the surface roughness of the workpiece processed by CeO2 SAG. The modelling considered the effects of the protrusion height of active grains in the grinding wheel and the sizes and mass fractions of CeO2 particles in the grinding zone on undeformed chip thickness (UCT). Then, the mechanism of CeO2 SAG was investigated through nanoindentation method. Indentation hardness and energy spectrum of the surface were estimated to verify the softened layer. The results showed that the model of surface roughness was well consistent with the experiment. The CeO2 particle size significantly influenced on the surface roughness than the mass fraction. The load-bearing effect of larger CeO2 particle size reduced the protruding height of the grinding wheel grains and reduced the UCT to a greater extent in grinding process. The chemical reaction between CeO2 slurry and BK7 glass results in a softening layer which enhances the critical load and critical depth of ductile-brittle transition of grinding. Finally, the optimized parameters were used for CeO2 SAG of an ellipsoid BK7 optics.

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Section: Introductionmentioning

confidence: 99%

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Zhang¹,

Yao

Li³

et al. 2022

Preprint

View full text Add to dashboard Cite

show abstract

“…Now it is widely used in various industrial fields, such as aerospace, measuring equipment, MEMS, laser systems, etc. However, due to these excellent properties of optical glass materials, there are often some problems in machining, such as pits and cracks on the processing surface, destruction and chipping on the inport and export surfaces, tool wear, which ultimately lead to poor processing surface quality and precision, it is difficult to meet the application requirements of high-precision parts, limiting the expansion of optical glass in various fields [1][2][3][4]. Therefore, it is challenging to achieve high precision, high efficiency and low cost processing of optical glass.…”

Section: Introductionmentioning

confidence: 99%

Study on edge breakage of optical glass surface in ultrasonic vibration-assisted milling

Tong

Yang²,

Ye³

et al. 2022

Preprint

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Optical glass is an isotropic amorphous solid material, due to its excellent performance, it has been widely used in various fields. However, during the milling process, the optical glass will have defects such as chipping and cracks on the surface, import and export, and side edges, these defects seriously affect the application of optical glass. In order to study the formation mechanism of defects such as chipping and cracks during optical glass processing, experimental and theoretical study of optical glass milling using ultrasonic vibration-assisted milling (UVAM), the chipping depth model of the export edge collapse was established. The results show that, the main reason for the edge chipping defect is that the optical glass will crack on the subsurface during processing, the propagation of these cracks causes the matrix material to tear and crumble. By comparing and analyzing the results of ultrasonic vibration milling and ordinary milling, ultrasonic vibration can significantly reduce this phenomenon, and it is found that the cutting depth and feed per tooth have a great influence on the export chipping depth value, and the influence of spindle speed is less. In addition, when the amplitude of the ultrasonic wave is applied, not only the import and export edge chipping phenomenon can be significantly improved, but also the surface quality can be significantly improved. Therefore, the application of ultrasonic vibration-assisted milling to the processing of optical glass can improve the surface and edge quality, which is help improve the application range of optical glass.

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“…For new materials such as CFRP and additively manufactured materials, the vibration-assisted machining (VAM) process is a capable technology [5,6]. A field of application in classic hard materials, for example, is the optical industry with the processing of glasses and lenses made of quartz glass or borosilicate crown glass (BK7) [7][8][9]. During the grinding of brittle and hard materials according to Inasaki, two crack systems, i.e., median/radial cracks and lateral cracks, occur.…”

Section: Introductionmentioning

confidence: 99%

Design of a contactless powered and piezoelectric-actuated tool for non-resonant low-frequency vibration-assisted machining of brittle-hard materials

Brier

Bleicher

2021

Int J Adv Manuf Technol

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Ultrasonic-assisted grinding (UAG) is the state-of-the-art process for machining of brittle-hard materials. In comparison to conventional processes, the main advantages lie in the reduction of tool wear and process forces. Such a vibration system is based on a resonant actuator and a power supply unit generating the alternating current. Both units are interconnected by a contactless energy transfer (CET) system. This system configuration shows one optimal working point at the resonant frequency with maximum amplitude, which is significantly depending on the tool shape. In this work, a piezo-activated tool system is designed to realize non-resonant low-frequency vibrations. Major emphasis is put on the thermal behavior of the piezo drive, particularly on the in-process heating depending on the working frequency. In addition, focus lays on the theoretical and numerical design of the radial operating transducer CET system for a previously set actuator design. As a result, this system configuration offers a fully variable adjustment of the amplitude from under 1 to over 50 μm at frequency range. Outside this range, higher amplitudes can be achieved for short periods to the detriment of the fatigue strength according to FKM.

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Effect to the Surface Composition in Ultrasonic Vibration-Assisted Grinding of BK7 Optical Glass

Cited by 13 publications

References 35 publications

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Study on edge breakage of optical glass surface in ultrasonic vibration-assisted milling

Design of a contactless powered and piezoelectric-actuated tool for non-resonant low-frequency vibration-assisted machining of brittle-hard materials

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