2003
DOI: 10.3929/ethz-a-004502248
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Effective automated tape winding process with on-line bonding under transient thermal conditions

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“…Some of these approaches do not include an experimental validation of the results [36]. Other studies present a deeper analysis, making correlations with the results coming from other mechanisms as thermal degradation, consolidation or voids evolution [39,40,42,56]. Schledjewski and Miaris [14] report some information regarding to the best combination of heating distribution in both the incoming and the substrate material, being 60% for the incoming and 40% for the substrate the solution with the best mechanical properties.…”
Section: Process Simulation: Thermal Model Of the Isc Processmentioning
confidence: 99%
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“…Some of these approaches do not include an experimental validation of the results [36]. Other studies present a deeper analysis, making correlations with the results coming from other mechanisms as thermal degradation, consolidation or voids evolution [39,40,42,56]. Schledjewski and Miaris [14] report some information regarding to the best combination of heating distribution in both the incoming and the substrate material, being 60% for the incoming and 40% for the substrate the solution with the best mechanical properties.…”
Section: Process Simulation: Thermal Model Of the Isc Processmentioning
confidence: 99%
“…Most of the documents related to these models do not include the heat interchanges arising from material transformations, as melting (endothermal) and crystallization (exothermal), after demonstrating that its contribution to the general thermal profile is negligible [14,39,[56][57][58], with the exception of the simulations conducted by Nicodeau [59].…”
Section: Process Simulation: Thermal Model Of the Isc Processmentioning
confidence: 99%