Effective Computational Approach for Optimization of Temperature on Printed Circuit Board

Durgam, Shankar; Bhosale, Ajinkya; Bhosale, Vivek; Deshpande, Revati; Sutar, Pankaj; Kamble, Subodh

doi:10.1007/s40032-022-00805-z

Cited by 4 publications

(1 citation statement)

References 24 publications

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“…Experimental results and numerical predictions for validation of heater temperatures on different substrates for electronic components cooling are available in Durgam et al (2019Durgam et al ( , 2020b; Durgam (2021). The findings of simulation results of temperatures of heated blocks are compared with the temperature results of machine learning methods as a viable option for determining temperatures of heated modules Durgam et al (2022Durgam et al ( , 2020aDurgam et al ( , 2021. Jaluria et al (2020) have presented steady and transient heat transfer from data centers for its thermal management and reduced energy consumption by optimizing the cooling strategy.…”

Section: Introductionmentioning

confidence: 99%

Study of Substrate Conductance Effect on Cooling of Electronic Components

Durgam¹

2022

Front. Heat Mass Transf.

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This article explores experimentally and numerically the effect of conductance on cooling of electronic chips by forced air flow in a vertical channel for thermal control. Experiments are conducted using substrates of FR4, bakelite, copper clad board (single layer) equipped with aluminum heat sources at uniform heat fluxes of 1000, 2000, and 3000 W/m 2 at 500 ≤ Re ≤ 1500. Computer simulations are performed to validate experimental results using a finite element method based COMSOL Multiphysics 4.3b software and the results are in agreements of below 10%. The temperatures obtained showed high thermal conductance copper clad boards (CCBs) are very low compared to FR4 and bakelite substrates. Results showed that FR4 and bakelite are unsuitable for airflow velocity of 0.6 m/s and heat flux of 3000 W/m 2 . However, the temperature variation between single and multilayer CCB is 3 to 4 • C. The temperature reduction using CCB is 10 • C compared to FR4 and bakelite.

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