2008
DOI: 10.1016/j.matchemphys.2007.08.020
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Effectiveness of Si thin buffer layer for selective SiGe epitaxial growth in recessed source and drain for pMOS

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“…If we omit this process, epitaxial growth will not occur at a substrate temperature lower than 723 K. A 50-nm-thick Si buffer layer was deposited at 873 K immediately prior to the Si/GeB deposition to obtain a clean epitaxial growth surface by which the crystallinity of the deposited film was improved. 11,12) Rapid thermal annealing (RTA) equipment was used for annealing the samples.…”
Section: Methodsmentioning
confidence: 99%
“…If we omit this process, epitaxial growth will not occur at a substrate temperature lower than 723 K. A 50-nm-thick Si buffer layer was deposited at 873 K immediately prior to the Si/GeB deposition to obtain a clean epitaxial growth surface by which the crystallinity of the deposited film was improved. 11,12) Rapid thermal annealing (RTA) equipment was used for annealing the samples.…”
Section: Methodsmentioning
confidence: 99%