Tree-shaped Nanosheet FETS (NSFET) is the most dependable way to scale down the gate lengths deep. This paper investigates the 12nm gate length (LG) n-type Tree-shaped NSFET with the gate having a stack of high-k dielectric (HfO2) and SiO2 using different spacer materials, which can be done using TCAD simulations. The Tree-shaped NFET device with T(NS) = 5 nm, W(NS) = 25 nm, WIB = 5 nm, and HIB = 25 nm has high on-current (ION) and low off-current (IOFF). The 3D device with single-k and dual-k spacers are compared and its DC characteristics are shown. It is noted that the dual-k device achieves the maximum ION/IOFF ratio, which is 10 9 , compared to 10 7 because the fringing fields with spacer dielectric lengthen the effective gate length. Additionally, the impact of work function, interbridge height, width, gate lengths, and temperature, along with the device's analog/RF and DC metrics, is also investigated in this paper. Even at 12 nm LG, the proposed device exhibits good electrical properties with DIBL = 23 mV/V and SS = 62 mV/dec and switching ratio (ION/IOFF) = 10 9 . The device's performance confirms that Moore's law holds even for lower technology nodes, allowing for further scalability.