Effects of a thermal-ultrasonic stress relaxation process on the residual stress, mechanical properties and microstructures of C19400 copper alloy strips

Zhou, Fei; Zhang, Yanmin; Lu, Li; Song, Kexing; Gao, Hongjiao

doi:10.1016/j.msea.2022.143014

Cited by 18 publications

(4 citation statements)

References 34 publications

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“…The electrical conductivity of the alloy with the rolling strains of 3.2 and 4.3 was measured at different aging times, and the corresponding ϕ value was calculated. The scatter plot of lg ln 1 1−ϕ -lgt was drawn, and linear fitting of the data was performed according to Equation ( 5), as shown in Figure 13a. The values of n and b are measured from the slopes and intercepts of the fitted curves.…”

Section: Volume Fraction Of Precipitatesmentioning

confidence: 99%

“…Copper alloys show potential excellent conductivity, mechanical properties, and formability, and are widely used in many high-tech fields, such as lead frames, connectors, asynchronous traction motors, aerospace, etc. [1,2]. In the research field of copper alloys, alloying is often performed by adding alloying elements to improve the mechanical properties and high-temperature properties of the alloy, and further improve the properties of the alloy through plastic deformation and heat treatment.…”

Section: Introductionmentioning

confidence: 99%

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Effects of Cold Rolling Reduction Rate on the Microstructure and Properties of Cu-1.16Ni-0.36Cr Alloy after Thermo-Mechanical Treatment

Sun,

Li,

Song

et al. 2023

Materials

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In this paper, a Cu-Ni-Cr alloy was prepared by adding a Ni-Cr intermediate alloy to copper. The effects of the cold rolling reduction rate on the microstructure and properties of the Cu-1.16Ni-0.36Cr alloy after thermo-mechanical treatment were studied. The results show that the tensile strength of the alloy increased while the electrical conductivity slightly decreased with an increase of the cold rolling reduction rate. At a rolling strain of 3.2, the tensile strength was 512.0 MPa and the conductivity was 45.5% IACS. At a rolling strain of 4.3, the strength further increased to 536.1 MPa and the conductivity decreased to 41.9% IACS. The grain size and dislocation density decreased with an increase of the reduction rate in the thermo-mechanical treatment. However, when the rolling strain reached 4.3, the recrystallization degree of the alloy increased due to an accumulation of the dislocation density and deformation energy, resulting in a slight increase in the grain size and a decrease in the dislocation density. The texture strength of the brass increased due to the induced shear band, with an increase of the cold rolling reduction rate. The reduction rate promoted a uniform distribution of nano-scale Cr precipitates and further enhanced the strength via precipitation strengthening.

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Section: Volume Fraction Of Precipitatesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effects of Cold Rolling Reduction Rate on the Microstructure and Properties of Cu-1.16Ni-0.36Cr Alloy after Thermo-Mechanical Treatment

Sun,

Li,

Song

et al. 2023

Materials

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“…As the essential conductor material of integrated circuit (IC) lead frames, electric copper strips find extensive applications in electronic information, aerospace, and new energy fields [1,2]. The trend toward miniaturization in ICs demands more intricate and precise lead frames.…”

Section: Introductionmentioning

confidence: 99%

Quasi In Situ Study on the Slipping Behavior and Residual Stress of Copper Strip

Liu,

Zhu,

Zhou

et al. 2024

Metals

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The preparation method of integrated circuit lead frames has transitioned from stamping to etching, rendering them more sensitive to residual stress. Consequently, the dimensional deviations caused by residual stress become more pronounced, necessitating a thorough investigation into the copper strip processing process, particularly considering the high-precision requirements of the lead frame. A quasi in situ method was employed to monitor the deformation process, and quantitative analyses and graphical reconstructions of the residual stress were conducted. The results indicated that the orientation evolution did not exhibit a significant correlation with grain size or grain aspect ratio. However, the stored energy of the different grains was related to their orientations. Further analysis of slip traces revealed that single or multiple slipping may be activated in grain subdivisions, and the Schmid factor difference ratio (SFDR) value proved to be an effective tool for analyzing this deformation mode. An even more interesting finding was that the deformation mode directly affected the residual stress distribution in local regions. The relationship between residual stress, Schmid factor, and SFDR was further analyzed, and a clear correlation between SFDR and residual stress was found in this study.

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“…However, using these methods may decrease the strength of materials and cannot satisfy the requirements of high-end thin strips. A new thermal-ultrasonic coupling stress relief (TUSR) method suitable for thin strips was proposed in our previous work [5]. The residual stress reduction of TUSR was efficient, the residual stress in both directions reduced and the effect was more significant with the increasing amplitude.…”

Section: Introductionmentioning

confidence: 99%

Influence Mechanism of Texture Evolution on Residual Stress under Thermal-Ultrasonic Treatment

Yanmin

2023

JOJMS

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Thermal-ultrasonic coupling residual stress release experiment of C19400 copper alloy strip was carried out with self-made experimental device under different ultrasonic amplitudes. The texture evolution and residual stress relaxation of the strip were systematically studied. The results show that, with the increasing ultrasonic amplitude, the strength of cubic texture decreased, while the strength of Brass texture increased. Low-angle grain boundaries were mainly formed in brass texture owing to its high Taylor factor. The slip and interaction of dislocations lead to the grain rotation and the change in texture type, which was the main reason for the relaxation of residual stress.

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Effects of a thermal-ultrasonic stress relaxation process on the residual stress, mechanical properties and microstructures of C19400 copper alloy strips

Cited by 18 publications

References 34 publications

Effects of Cold Rolling Reduction Rate on the Microstructure and Properties of Cu-1.16Ni-0.36Cr Alloy after Thermo-Mechanical Treatment

Effects of Cold Rolling Reduction Rate on the Microstructure and Properties of Cu-1.16Ni-0.36Cr Alloy after Thermo-Mechanical Treatment

Quasi In Situ Study on the Slipping Behavior and Residual Stress of Copper Strip

Influence Mechanism of Texture Evolution on Residual Stress under Thermal-Ultrasonic Treatment

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