Effects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate

Tunthawiroon, Phacharaphon; Kanlayasiri, Kannachai

doi:10.1016/s1003-6326(19)65076-4

Cited by 43 publications

(8 citation statements)

References 36 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Compared with Fig. 4 a–d, it was again confirmed that the addition of Cu, Ni and Ag could inhibit the coarsening of floating Cu 6 Sn 5 compounds [ 31 – 33 ]. Figure 4 e and f clearly shows a similar coarsening procedure composing of cake-like Cu 6 Sn 5 and rod-like Ag 3 Sn phases after aging.…”

Section: Resultsmentioning

confidence: 61%

Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging

Xin

Wang

Sun

2022

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

In this work, various Cu, Ni, Ag-microalloyed Sn–5Sb/Cu joints, ordinary Sn–5Sb/Cu joints, and low-melting-point Sn–3Ag–0.5Cu (SAC305)/Cu (used for comparison) were prepared, focusing on the influence of Cu, Ni, and Ag on the microstructure evolution, interfacial IMC growth, and microhardness of Sn–5Sb/Cu joint under long-time isothermal aging process. Results showed that the microstructure of microalloyed joints consisted of β-Sn matrix, SbSn, and (Cu, Ni) 6 Sn 5 and Ag 3 Sn compounds. (Cu, Ni) 6 Sn 5 compounds generated a coarsening effect in the aging microalloyed joints, yet its coarsening speed is significantly lower than the ordinary Sn–5Sb/Cu. Meanwhile, the total IMC layer thickness increased with the rising aging time. A single fine dendritic (Cu, Ni) 6 Sn 5 IMC at the interface of microalloyed joint was observed and evolved into a larger scallop or layer-like duplex IMCs ((Cu, Ni) 6 Sn 5 + Cu 3 Sn) after the aging. Considering the combined effect of Cu, Ni, and Ag, the microalloyed joints exhibited the improved microstructure relative to ordinary counterparts and low-melting-point SAC305 materials, significantly inhibiting the interfacial IMC growth, especially Cu 3 Sn. The Cu 3 Sn IMC thickness and diffusion coefficient in the Sn–5Sb–0.5Cu–0.1Ni–0.5Ag/Cu joint were 0.71–2.81 μm and 0.96 × 10 –6 μm·s −2 , respectively. Besides, the precipitation strengthening mechanism triggered by the microalloyed elements was extremely obvious and the soldering and aging joints revealed superior microhardness values of 20–35 HV. This could effectively improve the application range of Sn–5Sb-based materials in higher-temperature package conditions such as third-generation semiconductors.

show abstract

Section: Resultsmentioning

confidence: 61%

Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging

Xin

Wang

Sun

2022

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

show abstract

“…Therefore, SnO, SnO 2 are also formed on the sample surface. See the following: ,− Sn + 2 OH − → Sn false( normalOH false) 2 + 2 e − Sn false( normalOH false) 2 → SnO + H 2 O SnO + H 2 O + 2 OH − → Sn false( normalOH false) 4 + 2 e − Sn false( normalOH false) 2 + H 2 O → Sn false( normalOH false) 4 + 2 e − Sn false( normalOH false) 4 …”

Section: Resultsmentioning

confidence: 99%

Effect of Glucose Contents on Electrochemical Corrosion Behavior of Ti/ZrO₂ Brazing Joint in SBF

Chen

Bian

Song

et al. 2023

ACS Biomater. Sci. Eng.

View full text Add to dashboard Cite

The effect of glucose content on the electrochemical corrosion behavior of the Ti/ZrO 2 brazing joint in simulated body fluid (SBF) was researched by the means of SEM morphologies, electrochemical and XPS analyses. Herein, pitting is observed to be a dominating corrosion model under the investigated glucose content. The pitting corrosion of the joint in 200 mg/dL SBF is minimal. In addition, the joint in 200 mg/dL SBF manifests the best corrosion resistance by electrochemical analyses, which indicates that glucose content has a bidirectional effect on corrosion of the Ti/ZrO 2 brazing joint. Additionally, the corrosion current value and impedance of titanium and brazing joint are close, which indicates that their corrosion resistance is similar. Finally, the OH − , Cl − , Sn 2+ /Sn 4+ and −COOH on the joint surface are found by XPS analysis, and the mechanism of Ti/ZrO 2 brazing joint corrosion is elucidated. The study provides a novel understanding of the corrosion behavior and relevant corrosion mechanism of the Ti/ZrO 2 brazing joint in body fluids with different glucose content.

show abstract

“…According to the literature, the Gibbs free energies for the formation of BaO 2 , Ag 2 O, and Al 2 O 3 are À643 kJ mol À1 , À11.2 kJ mol À1 , and À1573 kJ mol À1 , respectively. [23][24][25] Because BaO 2 is more stable than Ag 2 O, the oxygen in the BaO 2 layer tended not to react with the Ag electrode. In contrast, because Al 2 O 3 has the lowest Gibbs free energy, a spontaneous oxygen exchange reaction was expected to occur at the interface between BaO 2 and the Al electrode to form an interfacial AlO x layer [Fig.…”

Section: E Interface Effect On the Memory Performancementioning

confidence: 99%

Barium oxide write-once read-many-times memory with a high resistance window

Hsu,

Cai,

Long

et al. 2024

J. Mater. Chem. C

View full text Add to dashboard Cite

show abstract

Effects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate

Cited by 43 publications

References 36 publications

Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging

Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging

Effect of Glucose Contents on Electrochemical Corrosion Behavior of Ti/ZrO₂ Brazing Joint in SBF

Barium oxide write-once read-many-times memory with a high resistance window

Contact Info

Product

Resources

About

Effects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate

Cited by 43 publications

References 36 publications

Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging

Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging

Effect of Glucose Contents on Electrochemical Corrosion Behavior of Ti/ZrO2 Brazing Joint in SBF

Barium oxide write-once read-many-times memory with a high resistance window

Contact Info

Product

Resources

About

Effect of Glucose Contents on Electrochemical Corrosion Behavior of Ti/ZrO₂ Brazing Joint in SBF