Effects of Bi content on thermal, microstructure and mechanical properties of Sn-Bi-In-Zn solder alloy systems

Aksöz, Sezen; Esener, Pınar Ata; Öztürk, Esra; Maraşlı, Necmetti̇n

doi:10.1007/s10854-021-07144-2

Cited by 4 publications

(1 citation statement)

References 22 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Despite the excellent performance of the SAC solder alloy in terms of wettability and operating temperature, the presence of Ag Sn 3 intermetallic compounds (IMCs) has been reported as one of the disadvantages, having low strength and creep resistance under these conditions. Another disadvantage is that the Ag content is reported to be costly [17]. Adding Bi to SAC soldering alloys increases the wetting properties of the alloy [18], fatigue, and creep resistance [19].…”

Section: Introductionmentioning

confidence: 99%

Effect of Al addition on microstructure and wetting properties of quinary lead-free solder alloy systems

Oguz,

Erer

2023

Phys. Scr.

View full text Add to dashboard Cite

In this study, the wetting and microstructural properties of SACBi-xAl (x=0.05, 0.1, 0.3, 0.5, and 0.6%) quinary lead-free solder alloys produced by adding various amounts of Al to the quaternary SAC-1Bi lead-free solder alloy (wt%) were investigated. The wetting and microstructural properties of Al-added quinary lead-free solder alloys on Cu substrate in an Ar gas atmosphere were investigated. It wasreported that the best wetting angle (38.44° for the 325℃ temperature value) and melting temperature (212.5℃) belonged to the SACBi-0.1Al solder alloy. When the microstructural properties are examined, it is seen with the help of SEM images that the CuAl IMC phase, which is rich in Al, has replaced Cu6Sn5 and Ag3Sn IMCs.

show abstract

Section: Introductionmentioning

confidence: 99%