2019
DOI: 10.1016/j.msea.2019.138408
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Effects of bonding temperature on microstructure and mechanical properties of diffusion-bonded joints of as-cast Mg–Gd alloy

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Cited by 36 publications
(4 citation statements)
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“…These grain boundary migration phenomena are reported in diffusion welding. [39,40] During the process of IFW, the maximum temperature from the WZ (heat source) to the BM decreases continuously. Therefore, the area closer to the WZ has a lower YS, and consequent higher degree of deformation decreases the recrystallization temperature.…”
Section: Discussionmentioning
confidence: 99%
“…These grain boundary migration phenomena are reported in diffusion welding. [39,40] During the process of IFW, the maximum temperature from the WZ (heat source) to the BM decreases continuously. Therefore, the area closer to the WZ has a lower YS, and consequent higher degree of deformation decreases the recrystallization temperature.…”
Section: Discussionmentioning
confidence: 99%
“…However, the size of those precipitated phases distributed on the grain boundary becomes growing, which leads to the fact that crack sources initiate near the precipitates and propagate along with the phase interface. [ 27,28 ] As a result, for the as‐cat LZY alloys, when the contents of the Zn and Y were continuously increased from 3 and 1 wt% to 2 and 6 wt%, respectively, the EL of the alloy decreased apparently.…”
Section: Discussionmentioning
confidence: 99%
“…The microstructure typically exhibits aspects of as-melted metallic alloys with Mg 2 Ca tabular intermetallic structures and particles of Mg 5 Gd which are proportionally equably distributed. The enhancement with Gd shows the growth of round particles with a separation trend of somewhat uniformly distributed black dots [48]. The structural appearance of the SEM images of the said specimens is shown in Figure 2 and the existence of an intermetallic stage is noticeable.…”
Section: Microstructural Analysismentioning
confidence: 91%
“…In quantitative terms, the percentage of Gd significantly influenced the behavior of the alloy at values higher than 2 wt.% of Gd. It is known that both intermetallic compounds have a significant influence on the electro-corrosion resistance of Mg-based materials [48,49]. The open circuit potential (OCP) shows close values for all samples, decreasing with the elevated percentage of the alloying element.…”
Section: Electrochemical Corrosion Resistance Analysismentioning
confidence: 99%