2019
DOI: 10.3390/app9071395
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Effects of Bottom Layer Sputtering Pressures and Annealing Temperatures on the Microstructures, Electrical and Optical Properties of Mo Bilayer Films Deposited by RF/DC Magnetron Sputtering

Abstract: Most of the molybdenum (Mo) bilayer films are deposited by direct current (DC) magnetron sputtering at the bottom and the top layer (DC/DC). However, the deposition of Mo bilayer film by radio frequency (RF) Mo bottom layer and DC Mo top layer magnetron sputtering has been less studied by researchers. In this paper, the bottom layer of Mo bilayer film was deposited by RF magnetron sputtering to maintain its good adhesion and high reflectance, and the top layer was deposited by DC magnetron sputtering to obtain… Show more

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Cited by 4 publications
(2 citation statements)
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References 32 publications
(31 reference statements)
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“…With the increase in the thickness of the MoSe 2 layer from 33.67 nm to 72.25 nm, the resistance of the Mo contact produced at 140 W was higher than that produced at 80 W as shown in Figure 9 b, with mean values of 10 Ω and 13 Ω, respectively. In agreement with the observations in previous studies [ 12 , 50 , 51 , 52 , 53 , 54 ]. Overall, with the reduction in the grain size as the number of grain boundaries reduces, so did the dislocation density and micro-strain, resulting in higher carrier mobility and lower resistivity.…”
Section: Analysis and Discussionsupporting
confidence: 93%
“…With the increase in the thickness of the MoSe 2 layer from 33.67 nm to 72.25 nm, the resistance of the Mo contact produced at 140 W was higher than that produced at 80 W as shown in Figure 9 b, with mean values of 10 Ω and 13 Ω, respectively. In agreement with the observations in previous studies [ 12 , 50 , 51 , 52 , 53 , 54 ]. Overall, with the reduction in the grain size as the number of grain boundaries reduces, so did the dislocation density and micro-strain, resulting in higher carrier mobility and lower resistivity.…”
Section: Analysis and Discussionsupporting
confidence: 93%
“…The MS method offers the possibility to control the chemical composition and the film thickness to obtain good uniformity on the surface of the sample [ 22 ]. MS provides high adhesion of the films and excellent coverage of the substrate surface [ 23 ]. High deposition rates and high-purity films can be achieved using MS [ 24 ].…”
Section: Introductionmentioning
confidence: 99%