Effects of compounding techniques on the properties of mica‐reinforced engineering thermoplastics

Wright, A. N.; Hawley, George

doi:10.1002/adv.1987.060070303

Cited by 2 publications

(1 citation statement)

References 6 publications

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“…A somewhat unexpected consequence of our results is that polymer processing strategies designed expressly to avoid polymer degradation by minimizing the processing time at high temperature (i.e. use of kinetic mixers [16]) may lead, with metal-filled materials, to products in which the interfacial adhesion is less than optimal.…”

Section: Resultsmentioning

confidence: 92%

Adhesion at copper- polyamide 11- copper and aluminum-poly amide 11-aluminum laminate interfaces: influence of metal surface oxidation

Gundjian

Fisa

1997

Journal of Adhesion Science and Technology

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Adhesion at copper-polyamide 11-copper and at aluminum-polyamide 11-aluminum laminate interfaces was studied. Metal-polymer-metal laminates were prepared by compression molding using processing conditions similar to the normal melt processing of polyamide 11. The results show that the time of contact at the molding temperature required to reach a constant level of adhesion is significant. Mild oxidation of the metal prior to molding improves the adhesion of polyamide 11 to aluminum; with copper, a monotonic slow decrease in adhesion with the oxidation time is observed. The presence of a metal surface affects the crystallization behavior of polyamide. With a cooling rate of 40-50°C/min, an approximately 15 µm transcrystalline polymer layer is formed with a degree of crystallinity that is almost 10% higher than the material away from the interface. The metal substrate surface oxidation prior to molding does not change the crystallinity profile of the polymer in the bulk. The polymer surface crystallinity is also a function of the time of contact with the metal substrate. The cooling rate and the metal substrate structure and its nucleating activity are responsible for the surface/bulk crystallinity ratio. Although the highly-crystalline polymer surface layer improves the adhesion to some extent, the formation of active species on the polymer surface which are able to react with the metal surface is mostly responsible for the increase of adhesion with time and its ultimate strength.

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Section: Resultsmentioning

confidence: 92%

Adhesion at copper- polyamide 11- copper and aluminum-poly amide 11-aluminum laminate interfaces: influence of metal surface oxidation

Gundjian

Fisa

1997

Journal of Adhesion Science and Technology

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Factors Affecting Adhesion at Copper-Polyamide 11 and Aluminum-Polyamide 11 Interfaces

Gundjian¹,

Fisa

1997

Journal of Thermoplastic Composite Materials

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Adhesion at polyamide 11-copper and polyamide 11-aluminum interfaces was studied. Metal-polymer-metal laminates were prepared by compression molding using processing conditions similar to the normal melt processing parameters of polyamide 11. The results show that the time of contact at the molding temperature required to reach contact level of adhesion is significant (several minutes). The state of the metal surface affects adhesion. Mild oxidation (prior to molding) improves adhesion with aluminum; with copper, a monotonous slow decrease of adhesion with oxidation time is observed. The presence of the metal surface affects the crystallization behavior of polyamide. Upon a relatively slow cooling rate (40-50'C/min), a transcrystalline layer about 15 1Lm thick is formed having a degree of crystallinity almost 10% higher than the material away from the interface. In the absence of the transcrystalline layer, the level of adhesion is significantly lower.

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Effects of compounding techniques on the properties of mica‐reinforced engineering thermoplastics

Cited by 2 publications

References 6 publications

Adhesion at copper- polyamide 11- copper and aluminum-poly amide 11-aluminum laminate interfaces: influence of metal surface oxidation

Adhesion at copper- polyamide 11- copper and aluminum-poly amide 11-aluminum laminate interfaces: influence of metal surface oxidation

Factors Affecting Adhesion at Copper-Polyamide 11 and Aluminum-Polyamide 11 Interfaces

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