Theoretical physics foretells that "strain engineering" of graphene could hold the key to finding treasures still hidden in two-dimensional (2D) condensed matter physics and commercializing graphene-based devices. However, to produce strained graphene in large quantities is not an easy task by any means. Here, we demonstrate that thermal annealing of graphene placed on various substrates could be a surprisingly simple method for preparing strained graphene with a large area. We found that enhanced graphene-substrate interfacial adhesion plays a critical role in developing strained graphene. Creative device architectures that consider the thermal mismatch between graphene and the target substrate could enable the resulting strain to be intentionally tailored. We believe that our proposed method could suggest a shortcut to realization of graphene straintronics.As a promising material for future electronic devices, graphene has come into the spotlight in diverse fields and is being developed at a relentless pace [1, 2]. Many researchers are endeavoring to find treasures hidden in the "flatland" today. However, despite many efforts, the emergence of commercial graphenebased applications still seems unattainable. Moreover, professional skepticism regarding the applicability of graphene applications, particularly prevalent among the scientific community's doyens, is increasing. Therefore, a technological breakthrough is truly needed to change the current atmosphere. In the early 1980s,