Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors

Samavatian, Vahid; Iman‐Eini, Hossein; Avenas, Yvan; Samavatian, Majid

doi:10.1109/tpel.2020.2973312

Cited by 44 publications

(45 citation statements)

References 38 publications

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“…On the other side, the SAC solders with higher CTE values are found more susceptible to the fatigue damage during a thermal cycling process in comparison with the SnPb solder. With a geometrical approach, the solder layer thickness is one of the most important variables affecting the reliability of the electronic devices 2,5 . Therefore, we analyzed an electronic assembly similar to that considered in Fig.…”

Section: Resultsmentioning

confidence: 99%

“…Thanks to the publicity available resources 5,[39][40][41][42][43][44][45] , we also created a huge number of input data to enrich the data resource needed to train the proposed model. It is worth-mentioning that all the collected data are extracted from the finite element model (FEM) simulation outcomes.…”

Section: Proposed Methodologymentioning

confidence: 99%

“…Several feature candidates were historically taken into account in order to meticulously characterize the thermal loading. It was extensively reported that the creep and fatigue phenomena are the two most crucial failure mechanisms in the solder joints of electronic devices 2,5 . Accordingly, we consider both of these phenomena in this study.…”

Section: Proposed Methodologymentioning

confidence: 99%

“…74 . It has been extensively reported that the creep-fatigue failure mechanisms play significant roles in the solder joint degradation 2,5,53 . Both these phenomena are physically triggered by multiple aforementioned contributory factors (see Table 1).…”

Section: Proposed Methodologymentioning

confidence: 99%

“…Among many unresolved concerns, the reliability assessment and lifetime prediction of solder joints in electronic devices have remained a long lasting challenge for researchers, engineers, and developers 1 – 3 . Among several external factors influencing the reliability of solder joints, thermal cycling is a main one mostly involving every electronic system 4 , 5 . Many physical models have been proposed so far to tackle the existing challenges on reliability assessment of solder joints 6 – 9 .…”

Section: Introductionmentioning

confidence: 99%

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Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

Samavatian

Fotuhi‐Firuzabad

Samavatian

et al. 2020

Sci Rep

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The quantity and variety of parameters involved in the failure evolutions in solder joints under a thermo-mechanical process directs the reliability assessment of electronic devices to be frustratingly slow and expensive. To tackle this challenge, we develop a novel machine learning framework for reliability assessment of solder joints in electronic systems; we propose a correlation-driven neural network model that predicts the useful lifetime based on the materials properties, device configuration, and thermal cycling variations. The results indicate a high accuracy of the prediction model in the shortest possible time. A case study will evaluate the role of solder material and the joint thickness on the reliability of electronic devices; we will illustrate that the thermal cycling variations strongly determine the type of damage evolution, i.e., the creep or fatigue, during the operation. We will also demonstrate how an optimal selection of the solder thickness balances the damage types and considerably improves the useful lifetime. The established framework will set the stage for further exploration of electronic materials processing and offer a potential roadmap for new developments of such materials.

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Section: Resultsmentioning

confidence: 99%