Effects of Cuprous Ion on Electrodeposition of Aluminum from AlCl₃-BMIC Ionic Liquid

Abstract

The effect of Cu(I) ions on electrodeposition of aluminum from AlCl3-BMIC (AlCl3-1-butyl-3-methylimidazolium chloride) ionic liquid was investigated. The cyclic voltammetry and cathodic polarization analyses showed that Cu(I) ions obviously decreased the nucleation overpotential of Al and promoted the reduction reaction of Al (III). The analysis of thechronoamperometric transients indicated that the presence of Cu(I) does not change the nucleation and growth mode of Al deposition, but affects nucleation rate. Besides, the addition of Cu(I) slightly decreased the cathodic current efficiency (CE), increased the power consumption (PC), and reduced the purity of Al deposit. X-ray diffractogram revealed the presence of Cu(I) ions in electrolyte affected the preferred orientations of the electrodeposited Al by promoting the growth of (220) plane. SEM images showed that the grain of the Al deposit was refined with the increase of Cu(I) ions.

An Assessment of Aluminum Electrodeposition from Aluminum Chloride/4-ethylpyridine Ionic Liquid at Ambient Temperature

“…7A-7C, however, deviated from the theoretical curve, in agreement with that the growth of the Al deposit was not mass transport-limited. Similar 3D-instantaneous nucleation process have been observed for the electrodeposition of Al on glassy carbon electrode (GC) in AlCl 3 /urea ILs, 19,21 on tungsten electrode in AlCl 3 /(urea + acetamide) IL, 20 on GC in choline chloride/urea/AlCl 3 electrolytes, 36 steel electrode in AlCl 3 -BMIC IL, 37 and a nitrogen-incorporated tetrahedral amorphous carbon electrode (tac:N) electrode. 38 Due to the adsorption of 4-EP on the electrode surface, the fitted nucleation mechanism may not precisely reflect the real mechanism, and should be considered with caution.…”

Effects of Cu(i) contents on the voltammetric behavior and electrodeposition mechanism of bimetallic composite ionic liquids

“…Generally, for the research study of Cu(I)-containing ILs, Cu(I) is introduced into ILs by the anodic dissolution of the copper wire or the direct addition of cuprous compounds, but the content of Cu(I) was at the millimolar (mM) level. 20,33,34 Much attention has been generally focused on the effects of Cu(I) on the composition and morphology of deposits, 31,35 lacking the gradual process along with the content of Cu(I). Meanwhile, the effect of the Cu(I) content on the electrodeposition mechanism has not been investigated yet, which directly determines the routes and reaction pathways of the electrochemical treatment, and thus promotes green chemistry and chemical process.…”

Eco-Friendly Electrodeposition of Al-Zn Alloy from AlCl3-Urea Deep Eutectic Solvent

“…6,7 Electrodeposition is an optional method for its easy operation, controllable composition of product, and low cost. 8,9 Since the deposition potential of Al is far more negative than the hydrogen evolution potential, electrodeposition of Al-Zn alloy coatings can be performed only from non-aqueous electrolyte. Nevertheless, high temperature molten salts are highly corrosive and high energy consuming limited by high-temperature operation, and organic solvents are generally volatile, toxic and flammable.…”