Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study

Fan, Guowei; Hu, Zengming; Xu, Jie; Tang, Junqi; Liu, Dashun; Fang, Zeming; Luo, Li; Liu, Qianfa; Lu, Dong; Xue, Ke; Wang, Ke

doi:10.1007/s10854-024-13499-z

J Mater Sci: Mater Electron

2024

DOI: 10.1007/s10854-024-13499-z

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Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study

Guowei Fan,

Zengming Hu,

Jie Xu

et al.

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Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study

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References 20 publications

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