Effects of different drop test conditions on board-level reliability of chip-scale packages

Lai, Yi‐Shao; Yang, Po-Chun; Yeh, Chang-Lin

doi:10.1016/j.microrel.2007.03.005

Cited by 41 publications

(18 citation statements)

References 19 publications

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“…[3][4][5] Development of several BIT apparatuses has been reported in recent years. 1,2,[6][7][8][9][10] To date, the majority of BIT studies have presented only failure-mode statistics because the specific test apparatuses employed in these studies might not allow accurate measurements of force and displacement responses induced by the impact load.…”

Section: Introductionmentioning

confidence: 99%

Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints

Lai

Song

Chang

et al. 2007

Journal of Elec Materi

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In this work, we present ball impact test (BIT) responses and fractographies obtained at an impact velocity of 500 mm/s on Sn-4Ag-0.5Cu, Sn-1Ag-0.5Cu, Sn-1Ag-0.5Cu-0.05Ni, Sn-1.2Ag-0.5Cu-0.05Ni, and Sn-1Ag-0.5Cu-0.05Ge package-level solder joints. The solder joints are bonded on substrate pads of either immersion tin (IT) or direct solder on pad (DSOP) surface finishes. Differences of BIT results with respect to multi-reflow are also reported. Taking the impact energy as an indication of board-level drop reliability of the solder joints, the BIT results indicate that better reliability can be achieved by adopting Sn-Ag-Cu solder alloys with low Ag weight contents as well as IT substrate pad finish rather than DSOP. Moreover, the addition of Ni or Ge to the solder alloy provides a large improvement; Ni alters the interfacial intermetallic compound (IMC) structure while Ge enhances the mechanical behavior of the bulk solder.

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Section: Introductionmentioning

confidence: 99%

Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints

Lai

Song

Chang

et al. 2007

Journal of Elec Materi

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“…Similar results were reported in previous papers. 13,22 The drop numbers of underfills A, B, C, and D for channel 3 were reduced by about 90%, 82%, 85%, and 77% compared with channel 1, respectively, after 500 h TH testing (Fig. 5a).…”

Section: Adhesive Strength Of Underfillsmentioning

confidence: 97%

“…Ensuring reliability under mechanical stress has been reported to be more important than under thermal stress. [10][11][12][13] The board-level drop test has recently attracted strong research interest, because it is a key qualification test for portable electronic products, and use of lead-free solder alloys reduces the drop shock reliability of packages.…”

Section: Introductionmentioning

confidence: 99%

“…17,18 Many studies have been performed to investigate the drop reliability of board-level packages, varying parameters such as drop test conditions, under bump metallurgy, solder, PCB finishes, and pad structure. [1][2][3][4][5][6][7][8][9][10][11][12][13] Nevertheless, insufficient studies have investigated the drop reliability of board-level packages with different kinds of underfill under hygrothermal and mechanical stresses. Therefore, we investigated the hygrothermal and mechanical reliability of board-level packages with various underfills using the temperature and humidity (TH) test and drop test.…”

Section: Introductionmentioning

confidence: 99%

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Effects of Different Kinds of Underfills and Temperature–Humidity Treatments on Drop Reliability of Board-Level Packages

Noh

Yoon

et al. 2010

Journal of Elec Materi

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The hygrothermal and mechanical reliability of board-level packages with various underfills under sequential temperature and humidity (TH) testing and drop testing were investigated. Board-level packages with underfill had greater resistance to drop shock than that without underfill, indicating that underfill protects the package from failure by absorption of the applied drop shock. The underfill, which was composed of polypropylene glycol epoxy resin and silane, exhibited good reliability for drop shock because of the improved adhesion of the underfill compared with that without the polypropylene glycol epoxy resin and silane. In addition, the drop reliability of board-level packages with underfill decreased with increasing TH test duration. Adhesion between the substrate and underfill or between the solder and underfill was decreased by moisture absorption. Components positioned at the board center were more susceptible to failure by drop shock than were corner components.

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“…There has been a significant amount of research done in the last few years on drop impact reliability [1][2][3][4][5][6][7][8][9][10]. The JEDEC standard JESD22-B111 [11] for the board level and related standards [12,13] for the subassembly level have been developed for drop testing handheld electronics.…”

Section: Introductionmentioning

confidence: 99%

Drop impact reliability of edge-bonded lead-free chip scale packages

Farris¹,

Pan²,

Liddicoat³

et al. 2009

Microelectronics Reliability

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a b s t r a c tThis paper presents the drop test reliability results for edge-bonded 0.5 mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board. The test boards were subjected to drop tests at several impact pulses, including a peak acceleration of 900 Gs with a pulse duration of 0.7 ms, a peak acceleration of 1500 Gs with a pulse duration of 0.5 ms, and a peak acceleration of 2900 Gs with a pulse duration of 0.3 ms. A high-speed dynamic resistance measurement system was used to monitor the failure of the solder joints. Two edge-bond materials used in this study were a UV-cured acrylic and a thermal-cured epoxy material. Tests were conducted on CSPs with edge-bond materials and CSPs without edge bonding. Statistics of the number of drops-to-failure for the 15 component locations on each test board are reported. The test results show that the drop test performance of edge-bonded CSPs is five to eight times better than the CSPs without edge bonding. Failure analysis was performed using dyepenetrant and scanning electron microscopy (SEM) methods. The most common failure mode observed is pad lift causing trace breakage. Solder crack and pad lift failure locations are characterized with the dye-penetrant method and optical microscopy.

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Effects of different drop test conditions on board-level reliability of chip-scale packages

Cited by 41 publications

References 19 publications

Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints

Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints

Effects of Different Kinds of Underfills and Temperature–Humidity Treatments on Drop Reliability of Board-Level Packages

Drop impact reliability of edge-bonded lead-free chip scale packages

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