2010
DOI: 10.1143/jjap.49.06gn12
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Effects of Excimer Irradiation Treatment on Thermocompression Au–Au Bonding

Abstract: We studied the feasibility of using vacuum ultraviolet (VUV) treatment as a surface improvement technique with Au–Au flip-chip bonding. For fine-pitch electrical interconnections in three-dimensional (3D) stack applications, robust and reliable bonding is desirable; in this case, surface modification treatment is needed before the bonding process. A VUV surface treatment was used to remove organic contaminants. Samples of electroplated Au pads were examined by X-ray photoelectron spectroscopy (XPS) to evaluate… Show more

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Cited by 20 publications
(8 citation statements)
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“…Several Au–Au bonding techniques have been investigated to achieve low-temperature bonding, including thermocompression bonding [6,7,8,9,10,11,12], atomic diffusion bonding [4,13,14], and surface activated bonding (SAB) [15,16,17,18,19]. With SAB, the surfaces to be bonded are activated by plasma pretreatment and then bonded at low temperature (<150 °C).…”
Section: Introductionmentioning
confidence: 99%
“…Several Au–Au bonding techniques have been investigated to achieve low-temperature bonding, including thermocompression bonding [6,7,8,9,10,11,12], atomic diffusion bonding [4,13,14], and surface activated bonding (SAB) [15,16,17,18,19]. With SAB, the surfaces to be bonded are activated by plasma pretreatment and then bonded at low temperature (<150 °C).…”
Section: Introductionmentioning
confidence: 99%
“…Additionally, vacuum ultraviolet treatments using Xe 2 * excimer lamps were utilized to improve the bond strength of the flip chip and three dimensional (3D) interconnections. [20][21][22] UV lamps can provide large area exposures and short reaction times at low temperature and only require simple and inexpensive apparatus. However, the surface modification effects depend on the lamp parameters such as the wavelength and the intensity as well as on the chamber pressure and atmosphere.…”
Section: Introductionmentioning
confidence: 99%
“…So we need further studies to avoid these problems over graphene surface before bonding. Focus of research in an eco-friendly way such as VUV [8][9][10] and water vapor exposure method [11] for surface activation will be interesting in order to eliminate the existing process such as chemical, high temperature and harsh environment.…”
Section: Introductionmentioning
confidence: 99%