2016
DOI: 10.1016/j.tsf.2016.09.062
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Effects of fabrication method on defects induced by nitrogen diffusion to the hafnium oxide layer in metal–oxide–semiconductor field effect transistors

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Cited by 2 publications
(2 citation statements)
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“…It persists a relatively large band gap (>5 eV) [3], a high dielectric constant (∼25) [4], the good thermal and thermodynamic stability in contact with silicon [5]. Consequently, HfO 2 has been the focus of extensive research, especially for its application in high-k gate dielectrics as FETs [6,7].…”
Section: Introductionmentioning
confidence: 99%
“…It persists a relatively large band gap (>5 eV) [3], a high dielectric constant (∼25) [4], the good thermal and thermodynamic stability in contact with silicon [5]. Consequently, HfO 2 has been the focus of extensive research, especially for its application in high-k gate dielectrics as FETs [6,7].…”
Section: Introductionmentioning
confidence: 99%
“…HfO 2 has been studied as a replacement for conventional silicon dioxide (SiO 2 ) acting as a gate dielectric with an effective oxide thickness of 5-10 nm in advanced metal-insulator-semiconductor (MIS) technologies. [1][2][3][4][5][6][7][8][9][10][11] It has favorable thermal stability and a higher dielectric constant as compared with SiO 2 . In addition, the dielectric constant of monoclinic HfO 2 was still insufficient.…”
Section: Introductionmentioning
confidence: 99%