2006
DOI: 10.1109/jmems.2006.880352
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Effects of Fabrication Process Parameters on the Properties of Cyclic Olefin Copolymer Microfluidic Devices

Abstract: Among the materials used for fabricating microfluidic devices, plastics have been increasingly employed in the past few years. Although several methods for fabricating plastic devices have appeared in the literature, reports typically indicate one set of conditions that yield functional devices; little data are available detailing how results are affected by their changes in the process variables. We report in this paper a systematic study of fabrication process parameters including compression rate, molding t… Show more

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Cited by 51 publications
(56 citation statements)
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“…This feature, together with the relatively high bond strengths and overall simplicity of the approach, have made direct thermal bonding the most common method for sealing microfluidic chips. Thermal fusion bonding of various thermoplastics has been widely demonstrated, including PC Wang et al 2005;Park et al 2008;Shadpour et al 2007;Wang et al 2008), PMMA (Chen et al 2003;Arroyo et al 2007;Kelly and Woolley 2003;Liu et al 2008;Nie and Fung 2008;Nikcevic et al 2007;Sun et al 2006;Tan et al 2008;Yao et al 2005;Zhu et al 2007), and COC Bhattacharyya and Klapperich 2006;Riegger et al 2007;Tsao et al 2008;Steigert et al 2007;Fredrickson et al 2006;Olivero and Fan 2008). Direct thermal bonding of a wide range of polymers including polystyrene, nylon, polysulfone ) as well as polystyrene and copolyester ) have also been explored.…”
Section: Thermal Fusion Bondingmentioning
confidence: 99%
“…This feature, together with the relatively high bond strengths and overall simplicity of the approach, have made direct thermal bonding the most common method for sealing microfluidic chips. Thermal fusion bonding of various thermoplastics has been widely demonstrated, including PC Wang et al 2005;Park et al 2008;Shadpour et al 2007;Wang et al 2008), PMMA (Chen et al 2003;Arroyo et al 2007;Kelly and Woolley 2003;Liu et al 2008;Nie and Fung 2008;Nikcevic et al 2007;Sun et al 2006;Tan et al 2008;Yao et al 2005;Zhu et al 2007), and COC Bhattacharyya and Klapperich 2006;Riegger et al 2007;Tsao et al 2008;Steigert et al 2007;Fredrickson et al 2006;Olivero and Fan 2008). Direct thermal bonding of a wide range of polymers including polystyrene, nylon, polysulfone ) as well as polystyrene and copolyester ) have also been explored.…”
Section: Thermal Fusion Bondingmentioning
confidence: 99%
“…Plastic microfluidic devices are fabricated using the procedure described previously (Fredrickson et al 2006). Briefly, all patterns are designed using a CAD program (AutoCAD, San Rafael, CA) and fit on a standard 1 in.…”
Section: Device Fabricationmentioning
confidence: 99%
“…Both of them will be referred to as COC, following the practice of international union of pure and applied chemistry (IUPAC), an organization recognized as the world authority on chemical nomenclature (Shin et al 2005). Cyclic olefin copolymer is a low-cost polymer that has high organic solvent resistance, minimum water adsorption, glass-like optical clarity, and low background fluorescence (Fredrickson et al 2006). Its glass transition temperature (T g ) ranges from 70 to 160°C, depending on the type of resin or film.…”
Section: Introductionmentioning
confidence: 99%
“…Fan and co-workers created an array of microfluidic pseudo-valves for introducing different separation media, without cross-contamination, in both dimensions; the valves also allowed transfer of proteins from the first to the second dimension [46]. The two-layer device was fabricated from cyclic olefin copolymer, which is a low-cost polymer that has high organic solvent resistance, minimum water adsorption, glass-like optical clarity, and low background fluorescence [52]. The layout of the device is shown in Fig.…”
Section: Microfluidic Valves For 2-d Protein Separationmentioning
confidence: 99%