Effects of flow inlet angle on flow maldistribution and thermal performance of water cooled mini-channel heat sink

Kumar, Sanjeev; Singh, Pawan Kumar

doi:10.1016/j.ijthermalsci.2019.01.014

Cited by 67 publications

(14 citation statements)

References 20 publications

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“…Kandlikar [49] The 2° dual taper angle has the best performance which can maintain the surface temperature at 45.5 °C with a heat transfer coefficient of 22.5 kW/m2 °C Kumar & Singh [50] / Inlet/outlet arrangement with flow inlet angle θ = 105° has more uniform flow distribution in heat sink thus 2o lower temperature CPU compare to the conventional arrangement Zhao et al, [9] / Heat transfer performances of CPU with staggered arrangement grooves can be improved by 4.2% at best compared with that with aligned arrangement grooves. LB = Liquid Block (Channel Design) TEC = Thermoelectric Cooler HP = Heat Pipe TS = Thermosiphon JI = Jet Impingement…”

Section: Authors Lb Tec Hp Ts Ji Findings Chauhanmentioning

confidence: 99%

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A Review on Development of Liquid Cooling System for Central Processing Unit (CPU)

Harun

Sidik

2020

ARFMTS

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Electronic devices are becoming more efficient while getting a smaller size and compact design thus increase heat generation significantly. High heat generation from high technology electronic devices are needed to be cool down or control its temperature to prevent overheating problems. Due to the high cooling performance of liquid cooling, the electronic cooling system is shifting from an air-cooling system to a liquid cooling system. In the past few decades, numerous methods proposed by researchers for the central process unit (CPU) cooling using the liquid system either active cooling or passive cooling system. Other than physical configuration such as heat sink design, different configurations of working fluids are widely been studied by most of the researchers. Different working fluids have different heat transfer performance. Furthermore, a recent study has come out more interesting finding using nanofluid which can enhance heat transfer performance of liquid cooling. Nanofluid is a working fluid that has nanoparticles disperse in the base fluid which can increase the thermal properties of the based fluid. In this paper, comprehensive literature on the type of working fluid used in the respective system and methods of liquid cooling system for CPU including its cooling performance. Furthermore, this review paper discussed the different configuration of the liquid block and also the working fluid that had been used in the CPU cooling system.

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Section: Authors Lb Tec Hp Ts Ji Findings Chauhanmentioning

confidence: 99%

“…On the other hand, one of the researchers S. Kumar, P.K. Singh [50] come out with a novel inlet and outlet arrangement with different flow inlet angles. This is the further work of the Z-arrangement.…”

Section: Heat Sink Designmentioning

confidence: 99%

A Review on Development of Liquid Cooling System for Central Processing Unit (CPU)

Harun

Sidik

2020

ARFMTS

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“…It usually comprises single inlet and outlet ports, inlet/outlet manifolds and a multitude of micro/minichannels in the middle. Due to their geometric specificity, the presence of the coolant flow maldistribution may result in the thermal performance deterioration of the heat sink and the formation of localized temperature hot spots in the electronic device [10]. Therefore, one important issue that attracts great attention is how to properly deliver and distribute the cooling fluid across the parallel micro/mini channels in order to ensure the optimal cooling performance.…”

Section: Introductionmentioning

confidence: 99%

“…Kumar and Singh [10] numerically tested the effect of flow inlet angle between the inlet port and the parallel channels (theta = 90°, 105°, and 120°) on the flow distribution non-uniformity of water and the thermal performance of a mini channel heat sink. It was found that the inlet angle of 105° provided the best flow uniformity and the best thermal performance under the uniform heating condition.…”

Section: Introductionmentioning

confidence: 99%

Tailoring the fluid flow distribution in a parallel mini-channel heat sink under multiple-peak heat flux

Roux

Castlain

et al. 2022

Thermal Science and Engineering Progress

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“…Among recent studies in the field of improved heat transfer, Kumar and Pawan Kumar Singh [17] improved the heat performance of a mini-channel using a new inletoutlet approach. Among their observation, inlet-outlet arrangement with inflow angle equal to 105° has the smallest value of maldistribution factor, whereas conventional inletoutlet arrangement has the biggest value of maldistribution factor.…”

Section: Introductionmentioning

confidence: 99%

Three-dimensional numerical study of thermal exchanges in different geometry sections of mini-channels using three different nanoparticles

et al. 2020

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In the present work, we have studied the thermal exchanges of different geometry sections of mini-channels of a cooler numerically. Particularly, we have chosen a mini channels cooler copper for cooling an electronic chip IGBT. In our simulation of three-dimensional (3D), we have compared the numerical results for the different forms of the proposed mini-channels and the three different types of nano-fluids by using the Cu-water, the Ag-water, and the Diamond-water with a volume fraction of 0.02%. The numerical results are obtained by choosing a Reynolds number (Re) between 100 and 900 and considering that the flow regime is stationary. The simulation was performed using commercial software, ANSYS-Fluent 15.0. The results obtained show that the increase of the exchange surface between the walls of the mini channels and the cooling fluid makes increases the heat exchange coefficient and the improvement of the maximum junction temperature of the electronic chip IGBT with the increase of the Reynolds number. The choice of nanoparticles has considerable effects on improving the heat transfer and the maximum junction temperature of the chip IGBT.

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Effects of flow inlet angle on flow maldistribution and thermal performance of water cooled mini-channel heat sink

Cited by 67 publications

References 20 publications

A Review on Development of Liquid Cooling System for Central Processing Unit (CPU)

A Review on Development of Liquid Cooling System for Central Processing Unit (CPU)

Tailoring the fluid flow distribution in a parallel mini-channel heat sink under multiple-peak heat flux

Three-dimensional numerical study of thermal exchanges in different geometry sections of mini-channels using three different nanoparticles

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