Effects of gallium, phosphorus and nickel addition in lead-free solders: A review

Sonawane, Pushkaraj D.; Raja, V.K. Bupesh; Palanikumar, K.; Kumar, Eriki Ananda; Aditya, Narayana; Rohit, V.

doi:10.1016/j.matpr.2021.01.335

Cited by 14 publications

(2 citation statements)

References 24 publications

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“…However, some researchers considered that reinforcement of metallic (Co, Cu, Fe, Ni, Zn, Ag, Cu, Al, In, Ga, P, etc.) elements [33,80,111,112,[119][120][121][122][123] and ceramic (ZrO 2 , La 2 O 3 , TiO 2, Al 2 O 3 , SiC, etc.) [124][125][126][127][128] could also reduce the Cu 3 Sn thickness and voids.…”

Section: Explanation For Suppression Of Void Nucleationmentioning

confidence: 99%

Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review

Pal

Bajaj²

2023

Adv Eng Mater

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Void nucleation is a critical issue in wetting because it negatively impacts the solder joint and diminishes its electrical and mechanical properties. Generally, the Kirkendall effect (unbalanced diffusion) and Kirkendall voids (KVs) are developed due to dissimilar diffusivities of species (Cu and Sn) in a diffusion process. However, voids are also nucleated in the supersaturating condition, creating an additional position at or inside the “Kirkendall voids” interface. Various factors (surface modification, reinforcement of fourth elements, substrate type, and impurities) and the environment also support the nucleation of voids. Many researchers have discussed that KVs are nucleated into to intermetallic compounds layers. Reviewing the significant parameters for developing the KV in solid–liquid and solid–solid conditions is essential. Hence, in this review, the potential process of development of the KVs, concepts of thermodynamics, chemical reactions, and growth kinetics are developed. The position and reduction of KVs nucleation are also explained in this paper.

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Section: Explanation For Suppression Of Void Nucleationmentioning

confidence: 99%

Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review

Pal

Bajaj²

2023

Adv Eng Mater

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“…therefore, the improvement in the existing lead-free solder alloys was necessary as well as to keep pace with the current advancement in the electronic products. recent research has investigated on the addition of alloying elements in the solder alloys such as bismuth (Bi), phosphorus (P), gallium (Ga) and so on [8][9][10].the presence of these alloying elements has proven to improve the properties and performance of existing lead-free solder alloys [2,11].…”

Section: Introductionmentioning

confidence: 99%

A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy

Zaimi,

Salleh,

Al Bakri Abdullah

et al. 2023

Archives of Metallurgy and Materials

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A Short review on the influence of Antimony Addition to the microStructure And thermAl ProPertieS of leAd-free Solder Alloy for long time, Sn-Pb solder alloys have been used extensively as the main interconnection materials in the soldering. it is no doubt that Sn-Pb offers many advantages including good electrical conductivity, mechanical properties as well as low melting temperature. however, Pb is very toxic and Pb usage poses risk to human health and environments. owing to this, the usage of Pb in the electronic industry was banned and restricted by the legislation. these factors accelerate the efforts in finding suitable replacement for solder alloy and thus lead-free solder was introduced. the major problems associated with lead-free solder is the formation of large and brittle intermetallic compound which have given a rise to the reliability issues. Micro alloying with Sb seems to be advantageous in improving the properties of existing lead-free solder alloy. thus, this paper reviews the influence of Sb addition to the lead-free solder alloy in terms of microstructure formations and thermal properties.

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Microstructure, mechanical properties and corrosion analysis of Sn–0.7Cu + Ga solders joints developed using green concentrated solar energy soldering method

Sonawwanay

Raja

Salleh

et al. 2021

J Mater Sci: Mater Electron

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Effects of gallium, phosphorus and nickel addition in lead-free solders: A review

Cited by 14 publications

References 24 publications

Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review

Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review

A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy

Microstructure, mechanical properties and corrosion analysis of Sn–0.7Cu + Ga solders joints developed using green concentrated solar energy soldering method

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