Effects of GNSs addition on the electromigration of Sn58Bi and Cu-core Sn58Bi joint

Liu, Peng; Guo, Weiqi; Wu, Ping

doi:10.1007/s10853-022-07590-1

Cited by 10 publications

(4 citation statements)

References 38 publications

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“…On one hand, GNSs provide more channels for atomic migration due to the refined grain structure. On the other hand, GNSs do not move under the current and thus block the migration of atoms undergoing electromigration [ 110 ].…”

Section: Methods and Measures Of Electromigration Mitigation For Snbi...mentioning

confidence: 99%

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

Li,

Guo,

et al. 2024

Materials

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Due to the continuous miniaturization and high current-carrying demands in the field of integrated circuits, as well as the desire to save space and improve computational capabilities, there is a constant drive to reduce the size of integrated circuits. However, highly integrated circuits also bring about challenges such as high current density and excessive Joule heating, leading to a series of reliability issues caused by electromigration. Therefore, the service reliability of integrated circuits has always been a concern. Sn-based solders are widely recognized in the industry due to their availability, minimal technical issues during operation, and good compatibility with traditional solders. However, solders that are mostly Sn-based, such as SAC305 and SnZn, have a high melting point for sophisticated electronic circuits. When Bi is added, the melting point of the solder decreases but may also lead to problems related to electromigration reliability. This article reviews the general principles of electromigration in SnBi solder joints on Cu substrates with current flow, as well as the phenomena of whisker formation, voids/cracks, phase separation, and resistance increase caused by atomic migration due to electromigration. Furthermore, it explores methods to enhance the reliability of solder joint by additives including Fe, Ni, Ag, Zn, Co, RA (rare earth element), GNSs (graphene nanosheets), FNS (Fullerene) and Al2O3. Additionally, modifying the crystal orientation within the solder joint or introducing stress to the joint can also improve its reliability to some extent without changing the composition conditions. The corresponding mechanisms of reliability enhancement are also compared and discussed among the literature.

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Section: Methods and Measures Of Electromigration Mitigation For Snbi...mentioning

confidence: 99%

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

Li,

Guo,

et al. 2024

Materials

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“…Compared with pure Sn58Bi solder alloy, Sn58Bi solder doped with Ag nanoparticles restricts the migration of Bi atoms, leading to a 10 ~ 15% increase in shear strength of solder joints. Liu et al 13 reported that the addition of graphene nanoplates (GNS) also enhances the electromigration resistance of Sn58Bi/Cu solder joints. The addition of GNSs to Sn58Bi solder exhibits two competing mechanisms for electromigration behavior: one is the refinement of the microstructure, which provides more diffusion channels for Bi atoms; the other is the blocking effect on diffusing atoms.…”

Section: Introductionmentioning

confidence: 99%

Effect of electromigration on microstructure and properties of CeO2 nanopartical-reinforced Sn58Bi/Cu solder joints

Chen,

Zhang,

Fan

et al. 2024

Sci Rep

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To mitigate the decrease in mechanical performance of Sn58Bi/Cu solder joints resulting from electromigration-induced damage. The CeO2 nanoparticles were incorporated into Sn58Bi solder by a melt-casting method, and their effects on the microstructure and properties of Sn58Bi/Cu solder joints under electromigration were investigated. The study results demonstrate that the addition of 0.125 ~ 0.5 wt% CeO2 nanoparticles refines the eutectic microstructure of Sn58Bi solder alloy. At an addition amount of 0.5 wt%, the composite solder alloy exhibits the maximum tensile strength of 68.9 MPa, which is 37% higher than that of the base solder. CeO2 nanoparticle-reinforced Sn58Bi solder can achieve excellent solderbility with Cu substrates and the joints can significantly inhibit the growth of the anodic Bi-rich layer, which is responsible for electromigration. With the extension of current stressing time, Bi-rich and Sn-rich layer are respectively formed on the anode and cathode in the joints. The intermetallic compound (IMC) layer grows asymmetrically, transitioning from a fan-shaped morphology to a flattened structure at the anode and to a thickened mountain-like morphology at the cathode. Adding the CeO2 nanoparticles helps to mitigate the decrease in mechanical performance caused by electromigration damage during current application to some extent. Over the current stressing period of 288 ~ 480 h, the fracture position shifts from the anodic IMC/Bi-rich interface to the cathodic Sn-rich/IMC interface. The fracture mechanism transitions from a brittle fracture characterized by plate-like cleavage to a ductile–brittle mixed fracture with fine dimples and cleavage.

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“…For electronic packaging solder joints, the performance of the solder material directly determines the performance of the solder joint [1,2]. The conventional SnPb solder is widely used, attributed to its low melting point and cost, as well as excellent wettability and mechanical properties [3]. With the progress of lead-free solders, SnPb has been gradually abandoned due to the great harm to human beings and the environment, and there have been efforts to obtain a lead-free solder that can mimic the properties of SnPb solders [4][5][6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties

Gao

Zhang

et al. 2023

Metals

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Electromigration is one of the most important research issues affecting the reliability of solder joints. Current-induced Joule heating affects the electromigration behavior of solder joints. Solder joints with different cross-sectional areas were designed to obtain different Joule heating properties. The effects of the interfacial intermetallic compound (IMC) and mechanical properties of Sn58Bi/Cu solder joints were studied for different Joule heating properties. The results showed that as the cross-sectional area of the Sn58Bi/Cu solder joints increased, the Joule heating of the joint increased. The anode IMC thickness of the joint thickened and transformed into a planar shape. The Bi migrated to the anode region to form a Bi-rich layer and gradually increased in thickness. The cathode IMC thickness first increased, then decreased, and gradually dissolved. The Sn-rich layer formed near the solder side and gradually increased in thickness, with microcracks occurring when the cross-sectional area of the joint increased to 0.75 mm2. The joint shear fracture path moved from the soldering zone near the cathode IMC layer to the interfacial IMC layer. The fracture mechanism of the joint changed from a mixed brittle/tough fracture, dominated by deconstruction and secondary cracking, to a brittle fracture dominated by deconstruction. The joint shear strength was reduced by 60.9% compared to that in the absence of electromigration.

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Effects of GNSs addition on the electromigration of Sn58Bi and Cu-core Sn58Bi joint

Cited by 10 publications

References 38 publications

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

Effect of electromigration on microstructure and properties of CeO2 nanopartical-reinforced Sn58Bi/Cu solder joints

Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties

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