Effects of Grinding Parameters on the Processing Temperature, Crack Propagation and Residual Stress in Silicon Nitride Ceramics

Abstract

The surface/subsurface damage of engineering ceramics after machining has a great influence on the service performance of parts. In order to obtain a high grinding surface quality of engineering ceramics, and take silicon nitride ceramic as a research object, a series of grinding experiments were carried out. The effects of grinding parameters on longitudinal crack propagation depth and the surface residual stress of silicon nitride ceramics were analyzed by grinding experiments, and the residual stress at the location of crack propagation was obtained. The variation in the grinding temperature under different grinding parameters was explored. The influences of the grinding temperature on crack propagation depth and surface residual stress were clarified, the distribution of residual stress along the depth direction was discussed, and the relationship between the residual stress and crack propagation was revealed. The results show that the residual compressive stress on the surface of silicon nitride ceramics decreases with the increase in the depth of crack propagation and the degree of surface brittle spalling. The residual stress at the location of the crack propagation was residual tensile stress. The crack propagation depth increased with the increase in the residual tensile stress. The research provides a reference for the realization of high-quality surfaces in the grinding of silicon nitride ceramics.

Defect-free grinding of silicon nitride at high material removal rate

“…Unfortunately, present methods of laser-assisted machining impart cracks, phase transformation and chemical reactions, all of which highly disrupt microstructure. Lacking a regular crystalline lattice makes predicting crack magnitude, direction, and growth highly problematic [ 13 ].…”

Experimental investigations on surface topography and scratching performance of silicon nitride ceramics ablated by nanosecond pulsed laser

“…This process involves the clearance of material by the scraping action of abrasive particles of diverse shapes, sizes, and geometries [12][13]. Three types of abrasive actions, namely friction, plowing, and shearing, occur during the interaction between the grinding wheel and the work surface, collectively influencing the efficiency of the grinding process [14][15].In this case, grinding encounters great challenges when used for silicon nitride ceramic processing [16][17]. The method often gives rise to the generation of surface and subsurface cracks [18].…”