Effects of hot compression on distribution of Σ3n boundary and mechanical properties in Cu–Sn alloy

Jiang, Hui; Feng, Zhijun; Xue, Cun; Gao, Weifeng

doi:10.1007/s10853-018-2744-z

Cited by 10 publications

(4 citation statements)

References 22 publications

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“…When the compression temperature was above than 943 K, the type of serration changed from type B to type A + B. The serration transformation rules of the Cu–2.0Be alloy are not affected by the deformation temperature in the same manner as other copper alloy works with regard to hot compression [ 4 , 25 , 26 , 27 , 28 , 29 ].…”

Section: Resultsmentioning

confidence: 99%

“…When the compression temperature was above than 943 K, the type of serration changed from type B to type A + B. The serration transformation rules of the Cu-2.0Be alloy are not affected by the deformation temperature in the same manner as other copper alloy works with regard to hot compression [4,[25][26][27][28][29]. Samples for electron backscatter diffraction pattern (EBSD) analysis were mechanically and vibratory polished for 0.5 h by a Buehler VibroMet2 Vibratory Polisher.…”

Section: The Influence Of the Temperature And Strain Rate On The Serr...mentioning

confidence: 99%

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The Portevin–Le Chatelier Effect of Cu–2.0Be Alloy during Hot Compression

Zhu

Liu

et al. 2023

Materials

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The Portevin–Le Chatelier effect of Cu–2.0Be alloy was investigated using hot isothermal compression at varying strain rates (0.01–10 s−1) and temperature (903–1063 K). An Arrhenius-type constitutive equation was developed, and the average activation was determined. Both strain-rate-sensitive and temperature-sensitive serrations were identified. The stress–strain curve exhibited three types of serrations: type A at high strain rates, type B (mixed A + B) at medium strain rates, and type C at low strain rates. The serration mechanism is mainly affected by the interaction between the velocity of solute atom diffusion and movable dislocations. As the strain rate increases, the dislocations outpace the diffusion speed of the solute atoms, limiting their ability to effectively pin the dislocations, resulting in lower dislocation density and serration amplitude. Moreover, the dynamic phase transformation triggers the formation of nanoscale dispersive β phases, which impede dislocation and cause a rapid increase in the effective stress required for unpinning, leading to the formation of mixed A + B serrations at 1 s−1.

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Section: Resultsmentioning

confidence: 99%

Section: The Influence Of the Temperature And Strain Rate On The Serr...mentioning

confidence: 99%

The Portevin–Le Chatelier Effect of Cu–2.0Be Alloy during Hot Compression

Zhu

Liu

et al. 2023

Materials

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“…The results showed that dynamic recrystallization easily occurred under low strain rate conditions; when the strain rate was 1 s −1 and the temperature was 450 • C, the recrystallization mechanism was dominated by continuous dynamic recrystallization. At present, studies on Cu-Sn alloys have focused on recrystallization behavior in thermal deformation [17][18][19][20], and there are fewer studies on deformation behavior at medium temperatures.…”

Section: Introductionmentioning

confidence: 99%

Compressive Rheological Behavior and Microstructure Evolution of a Semi-Solid CuSn10P1 Alloy at Medium Temperature and Low Strain

Liu

Zhou

Xiong

et al. 2022

Metals

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Copper–tin alloys are widely used in the machining and molding of sleeves, bearings, bearing housings, gears, etc. They are a material used in heavy-duty, high-speed and high-temperature situations and subject to strong friction conditions due to their high strength, high modulus of elasticity, low coefficient of friction and good wear and corrosion resistance. Although copper–tin alloys are excellent materials, a higher performance of mechanical parts is required under extreme operating conditions. Plastic deformation is an effective way to improve the overall performance of a workpiece. In this study, medium-temperature compression tests were performed on a semi-solid CuSn10P1 alloy using a Gleeble 1500D testing machine at different temperatures (350−440 °C) and strain rates (0.1−10 s−1) to obtain its medium-temperature deformation characteristics. The experimental results show that the filamentary deformation marks appearing during the deformation are not single twins or slip lines, but a mixture of dislocations, stacking faults and twins. Within the experimental parameters, the filamentary deformation marks increase with increasing strain and decrease with increasing temperature. Twinning subdivides the grains into lamellar sheets, and dislocation aggregates are found near the twinning boundaries. The results of this study are expected to make a theoretical contribution to the forming of copper–tin alloys in post-processing processes such as rolling and forging.

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“…The Cu-Sn-P alloy is one of the earliest non-ferrous alloys used by humans [1][2][3]. To obtain good comprehensive performance to meet applications, P, Bi, Sb, and other elements are added into the Cu-Sn-P alloy, resulting in the formation of Cu-Sn-P alloy that possesses good mechanical properties [4].…”

Section: Introductionmentioning

confidence: 99%

The Microstructural Evolution of Cu-Sn-P Alloy during Hot Deformation Process

Zhao

Zhang

Du³

et al. 2022

Materials

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The microstructure evolution of Cu-Sn-P alloy subjected to hot deformation was researched through electron backscatter diffraction (EBSD) and transmission electron microscope (TEM) in the present study. The results indicated that after hot deformation, grains perpendicular to the force direction were elongated, and mostly became deformed grains, and then exhibited an obvious hardening effect. The Cu-Sn-P alloy could be strain hardened during hot deformation, but, with recrystallization, a softening effect occurred. Changes in dislocation density, textures, and grain sizes play different roles in flow stress behaviors of Cu-Sn-P alloy, and the dislocation density has a more evident effect at low temperature. However, with increase in temperature, recrystallization softening gradually dominates. Low-angle grain boundaries (LABs) account for the majority of hot deformed microstructures of Cu-Sn-P alloy. High dislocation densities in these zones make it easy to initiate the dislocation slipping systems. Deformation is realized through dislocation slipping and the slipping of edge dislocation pairs. The dislocation pile-up zones have high distortion energies, and, thus, elements of diffusion and recrystallization nucleation can occur easily. At different temperatures, the maximum polar density of textures gradually increases, and there are preferred orientations of grains. At 500 °C, stacking faults accumulate and promote the growth of twins. The twin growth direction is mainly determined by the migration of high-angle grain boundaries (HABs) and the clustering of high-stress zones.

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Effects of hot compression on distribution of Σ3n boundary and mechanical properties in Cu–Sn alloy

Cited by 10 publications

References 22 publications

The Portevin–Le Chatelier Effect of Cu–2.0Be Alloy during Hot Compression

The Portevin–Le Chatelier Effect of Cu–2.0Be Alloy during Hot Compression

Compressive Rheological Behavior and Microstructure Evolution of a Semi-Solid CuSn10P1 Alloy at Medium Temperature and Low Strain

The Microstructural Evolution of Cu-Sn-P Alloy during Hot Deformation Process

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