2004
DOI: 10.1016/j.compscitech.2003.11.007
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Effects of interfacial thermal barrier resistance and particle shape and size on the thermal conductivity of AlN/PI composites

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Cited by 145 publications
(51 citation statements)
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“…To date, there are no data for the interfacial thermal resistance of U-Mo/Al composites. In case of AIN/PI composites, the interfacial thermal resistance was estimated as 3.32 × 10 −7 [22]. It was predicted that the interfacial thermal resistance of U-Mo/Al would be lower than other composite materials in that U-Mo/Al has a metallic bonding.…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…To date, there are no data for the interfacial thermal resistance of U-Mo/Al composites. In case of AIN/PI composites, the interfacial thermal resistance was estimated as 3.32 × 10 −7 [22]. It was predicted that the interfacial thermal resistance of U-Mo/Al would be lower than other composite materials in that U-Mo/Al has a metallic bonding.…”
Section: Discussionmentioning
confidence: 99%
“…If the thermal resistance has a significant impact on the thermal conductivity, the particle size is one of the essential parameters for determining it. Numerous studies on composite systems [17][18][19][20][21][22] such as Ni/glass, ZnS/diamond, SiC/Al, diamond/Al, diamond/epoxy resins, and aluminum nitride powder filled polyimide (ANI/PI) showed that their effective conductivity may decrease with increasing particle size. This is because as the particle size decreases, the interfacial surface area between particles and the matrix increases.…”
Section: Interfacial Boundary Resistancementioning
confidence: 99%
“…The interfacial thermal resistance R k that offers resistance to heat flow reduces the effective conductivity of the nanoparticle in a composite medium (Jiajun and Xiao-Su 2004). This interfacial thermal resistance is dependent on the time constant τ of temperature decay of nanoparticle with the surrounding matrix, and it depends on the heat capacity C τ and thermal resistance of the nanoparticle-matrix interface R k (Shenogin et al 2004;Clancy and Gates 2006;Huxtable et al 2003).…”
Section: Atomistic Thermomechanical Properties Of Nanostructuresmentioning
confidence: 99%
“…Numerical and theoretical approaches have also been developed to obtain the thermal conductivity of the composites in addition to the experimental methods. The common analytical expressions include Maxwell's equation (Maxwell 1954), Maxwell-Eudken equation (EMT) (Davis and Artz 1995), Bruggeman's equation (Bruggeman 1935) and modified versions (Wang and Yi 2004). There are also some other numerical methods, such as Nelsen Model (Nielsen 1974), effective unit cell model (EUCM) (Ganapathy et al 2005), Agari's semi-empirical model (Agari et al 1990) and percolation model (Devpura et al 2000).…”
Section: Introductionmentioning
confidence: 99%