Effects of intermetallic compound layer thickness on the mechanical properties of silicon-copper interface

Ji, Chaoyue; Cai, Xintian; Zhou, Zhen; Fang, Dong; Liu, Sheng; Gao, Bing

doi:10.1016/j.matdes.2021.110251

Cited by 15 publications

(3 citation statements)

References 46 publications

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“…The interaction between Cu and Ti atoms is initially zero when no heat is applied to the Cu–Ti dissimilar interface [Figure 4(c)]. Because both the Cu crystal [face centred cubic (FCC)] and α-Ti crystal (HCP) have the same packing factor of 0.74, therefore, both of them have almost similar activation energy (approximately 195 KJ/mol) to start the diffusion mechanism in each other (Ji et al , 2021; Pugh, 2009; Zhu et al , 2016). The α -Ti generally crystallises at room temperature, whereas the β -Ti, having a body-centered cubic (BCC) crystal structure, crystallises at high temperature.…”

Section: Resultsmentioning

confidence: 99%

Evaluation of Cu-Ti dissimilar interface characteristics for wire arc additive manufacturing process

Mishra

Paul

Mukherjee

et al. 2022

RPJ

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Purpose The purpose of this research is to show the characteristics of a Cu–Ti dissimilar interface produced by a wire arc-based additive manufacturing process. The purpose of this research was to determine the viability of the Cu–Ti interface for the fabrication of functionally graded structures (FGS) using the wire arc additive manufacturing (WAAM) process. Design/methodology/approach This paper used the WAAM process with variable current vis-à-vis heat input to demonstrate multiple Ti-6Al-4V (Ti64) and C11000 dissimilar fabrications. The hardness and microstructure of the dissimilar interfaces were investigated thoroughly. The formation of Cu–Ti intermetallic at the Ti64/Cu fusion interface is been revealed by scanning electron microscopy and energy dispersive X-ray analysis, while X-ray diffraction was used to identify various Cu–Ti intermetallic phases. The effect of microstructure on interfacial sensitivity and hardness are also investigated. Findings The formation of CuTi intermetallic and the β-phase transformation in Ti-6Al-4V are found to be heat input dependent. The Cu diffusion length increases as the heat input for Ti64 deposition increases, resulting in a greater Cu–Ti intermetallic thickness. The Cu–Ti interface properties improve when the heat input is less than approximately 250 J/mm or the deposition current is less than 90 A. The microhardness ranges from 55 to 650 HV from the Cu-side to the interface and from 650 to 350 HV from the interface to the Ti-side. Higher current increases interface hardness, which increases brittleness and makes the interface more prone to interfacial cracking. Originality/value Nonlinear components are needed for a variety of extreme engineering applications, which can be met by FGS with varying microstructure, composition and properties. FGS produced using the WAAM process is a novel concept that requires further investigation. Despite numerous studies on Ti-clad Cu, information on Cu–Ti interface characteristics is lacking. Furthermore, the suitability of the WAAM process for the development of Cu–Ti FGS is unknown. As a result, the goal of this research article is to fill these gaps by providing preliminary information on the feasibility of developing Cu–Ti FGS via the WAAM process.

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Section: Resultsmentioning

confidence: 99%

Evaluation of Cu-Ti dissimilar interface characteristics for wire arc additive manufacturing process

Mishra

Paul

Mukherjee

et al. 2022

RPJ

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“…[27], the MEAM potential parameters of element pairs (each pair interaction is characterized by a total of 13 parameters) are shown in Table 2 . This potential is used by Ji et al [ 28 ] to evaluate the elastic–plastic behavior and adhesion behavior of the Si/Cu interface. Hue et al [ 29 ] used this potential to investigate the effect of strain rate on the mechanical properties of nanomultilayered aluminum 5052 alloys.…”

Section: Methodsmentioning

confidence: 99%

Molecular Dynamics Simulation of Solution Strengthening of Si and Cu Atoms in Aluminum Alloy

Kong

Zhang

2023

Physica Status Solidi (b)

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For heat‐treatable aluminum alloys, solid solute elements play key role in material strengthening. Al–Mg–Si alloy is a typical heat‐treatable alloy; Cu and Si atoms are its main solid solution atoms. To reveal the strengthening mechanism, the interaction between the edge dislocations and the Cu and Si solute atoms of different concentration in aluminum matrix is investigated by molecular dynamics (MD) simulation. Results indicate that Cu atoms provide a more effective strengthening due to the stronger pinning effect. The increment of critical resolved shear stress (ΔCRSS) is a function of concentration of solid solute atoms. When more than two types of solid solution atoms coexist in matrix, the final increment of the ΔCRSS is determined by the interactive effects of the atoms instead of the direct sum of all items. The pinning of Cu solid solute atoms can lead to two Shockley partial dislocations merging to an edge dislocation.

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“…By understanding how different factors, such as layer thickness, composition, and interface characteristics, influence the plastic deformation, strategies can be developed to enhance the composite’s resistance to deformation, and the microstructure and properties of composites can be tailored to meet specific application requirements [ 24 , 25 ]. Extensive research efforts have been devoted to investigating the plastic deformation behaviour of materials on the nanoscale under various conditions, including grain size [ 26 , 27 , 28 , 29 , 30 , 31 , 32 ], strain rate [ 31 , 32 , 33 ], grain boundaries (GBs), and interfacial interactions [ 5 , 23 , 34 , 35 , 36 , 37 , 38 ]. For instance, Liu [ 30 ] utilised the molecular dynamics (MDs) method to examine the plastic deformation phenomenon of nano-polycrystalline Mg, and observed the inverse Hall–Petch relation at the grain sizes below 10 nm.…”

Section: Introductionmentioning

confidence: 99%

The Plastic Deformation Mechanism in Nano-Polycrystalline Al/Mg Layered Composites: A Molecular Dynamics Study

Li,

Shen,

et al. 2024

Nanomaterials

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Understanding plastic deformation behaviour is key to optimising the mechanical properties of nano-polycrystalline layered composites. This study employs the molecular dynamics (MD) simulation to comprehensively investigate the effects of various factors, such as grain sizes, strain rates, and the interlayer thicknesses of the intermetallic compounds (IMCs), on the plastic deformation behaviour of nano-polycrystalline Al/Mg layered composites. Our findings reveal that the influence of grain size on deformation behaviour is governed by the strain rate, and an increase in grain size is inversely proportional to yield stress at low strain rates, whereas it is positively proportional to tensile stress at high strain rates. Moreover, an optimal thickness of the intermediate layer contributes to enhanced composite strength, whereas an excessive thickness leads to reduced tensile strength due to the fewer grain boundaries (GBs) available for accommodating dislocations. The reinforcing impact of the intermediate IMCs layer diminishes at excessive strain rates, as the grains struggle to accommodate substantial large strains within a limited timeframe encountered at high strain rates. The insights into grain sizes, strain rates, and interlayer thicknesses obtained from this study enable the tailored development of nanocomposites with optimal mechanical characteristics.

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Effects of intermetallic compound layer thickness on the mechanical properties of silicon-copper interface

Cited by 15 publications

References 46 publications

Evaluation of Cu-Ti dissimilar interface characteristics for wire arc additive manufacturing process

Evaluation of Cu-Ti dissimilar interface characteristics for wire arc additive manufacturing process

Molecular Dynamics Simulation of Solution Strengthening of Si and Cu Atoms in Aluminum Alloy

The Plastic Deformation Mechanism in Nano-Polycrystalline Al/Mg Layered Composites: A Molecular Dynamics Study

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