Effects of  Joint Height on the Interfacial Microstructure and Mechanical Properties of Cu-Cored SAC305 Solder Joints

Zhang, Yao; Jiang, Shan; Yin, Limeng; Ling, Diying; Zhang, Zhongwen; Zhang, Liping

doi:10.1007/s11664-020-08273-w

Cited by 4 publications

(2 citation statements)

References 8 publications

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“…Zhong studied the relationship between reflow cycle numbers and IMC thickness and conducted that the initially-formed IMC layer retarded the further extensive dissolution of the pad material and its interaction with the solder [10]. Yao reported that with increasing joint height, the thickness of the IMC at the two interfaces decreased, and the tensile strength also decreased for solder joints [11]. The proportion of Cu 3 Sn grew following the increase in reflow temperature, time, and cooling rate and the thickness of Cu 3 Sn formed at the center of the Cu 6 Sn 5 bottom was higher than that formed at the edge reported by Shang et al [12].…”

Section: Introductionmentioning

confidence: 99%

Effect of the reflow process on IMC growth for different devices and complex components

Cui¹,

Tian²,

Zhao³

et al. 2022

Smart Mater. Struct.

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Intermetallic compound (IMC), as an inevitable part between pad and solder, has a severe effect on the strength and reliability of microelectronic interconnection. Here, an investigation was carried out on IMC growth for different devices and complex components. The device-level experiments were conducted with five factors: peak temperature, time duration above solder liquidus temperature, the thickness of solder paste, surface finish types, and package types including BGA and QFP. Meanwhile, four complex components with the same reflow profile were conducted and compared for component-level experiments. A scanning electron microscopy was used to measure the thickness and determine the spatial distribution of the elements through the intermetallic compound. The multivariate analysis of the formation and growth of IMC during reflow soldering was studied based on Nernst-Shchukarev's equation and the results of the experiments. The difference in IMC thickness between BGA and QFP with different factors was discussed and compared separately. The results showed that the peak temperature and time above liquidus played a vital role in the IMC growth and the solder paste thickness and different pad metallization could not be ignored. SEM pictures of the solder and statistical results were revealed that the surface finish type has a marked impact on the formation of the IMC. For PCB with numbers of components, the IMC thickness and uniformity of solder joints at corner and center positions showed some regularity differences. Meanwhile, the bump shape (Cu1-xNix)6Sn5 IMC was observed for small size BGA with ENIG during the reflow process. The results have a significant meaning to optimize its reflow process parameters for complex components, to improve the interconnection reliability in engineering.

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Section: Introductionmentioning

confidence: 99%

Effect of the reflow process on IMC growth for different devices and complex components

Cui¹,

Tian²,

Zhao³

et al. 2022

Smart Mater. Struct.

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show abstract

“…Sn-Pb solders progressively took the place of lead-free solders in electronic packaging [5]. At present, the lead-free solders that have been widely used for electronic packaging are mainly Sn-Ag [6,7], Sn-Ag-Cu [8,9], Sn-Zn [10], Sn-Cu [11], Sn-Bi [12,13], etc., in recent years.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review

Wang

Zhang

2021

J Mater Sci: Mater Electron

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Electronic devices need to work at high temperature in some fields for a long time, peculiarly step soldering technology, primary packaging and flip-chip connections, etc., along with the application of electronic products more and more widely. These phenomena promote the further development of hightemperature solders. Because of the high melting temperatures of Sn-Ag and Sn-Sb, they are suitable for high-temperature fields such as automotive electronics and avionics. In this review, the influences of trace elements and nanoparticles on microstructure, intermetallic components (IMC) growth, mechanical properties, wettability, melting behavior, and creep behavior of Sn-Ag and Sn-Sb solders have been summarized systematically. It was found that the addition of trace elements or nanoparticles into solders to be beneficial in improving the performance of Sn-Ag and Sn-Sb solders. Besides, the melting behavior of the solder at high temperatures can be further improved if Sn-Ag and Sn-Sb are used better as high-temperature solders.

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Study of early-stage thermal fatigue behavior of Sn-based Cu-cored BGA solder joints

Han

Meng

Jin

et al. 2023

J Mater Sci: Mater Electron

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Effects of Joint Height on the Interfacial Microstructure and Mechanical Properties of Cu-Cored SAC305 Solder Joints

Cited by 4 publications

References 8 publications

Effect of the reflow process on IMC growth for different devices and complex components

Effect of the reflow process on IMC growth for different devices and complex components

Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review

Study of early-stage thermal fatigue behavior of Sn-based Cu-cored BGA solder joints

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