Effects of Methyl and Carbon-Carbon Double Bond in Anhydride Molecule on Dielectric Properties of Epoxy/Al<sub>2</sub>O<sub>3</sub> Composite

Zhao, Yushun; Xu, Yufan; He, Yuanhan; Wang, Kun; Chen, Yun

doi:10.1109/tdei.2021.009572

Cited by 21 publications

(3 citation statements)

References 22 publications

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“…Due to the large differences in the structural composition between the ceramic filler and polymer matrix, the interaction between them is weak, which produces interface defects and reduces the electrical strength of composites [16,17]. The coupling agent is a key factor in ensuring the properties of twophase composites [18].…”

Section: Introductionmentioning

confidence: 99%

Effect of organophilic group of coupling agent on the electrical performance of Boron Nitride/meta‐aramid composite paper

et al. 2022

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Organophilic groups of coupling agents can be the key factor for the electrical performance of Boron Nitride (BN)/meta‐aramid composite paper. In this article, four types of triethoxy‐silane coupling agents with different organophilic groups, including mercapto‐propyl (MP), glycidylether‐propyl (GP), amino‐propyl (AP) and trideca‐fluoro‐octyl (TFO) were studied. The structural and electrical properties of modified papers were compared, and the molecular simulation was conducted to reveal the interface interaction of modified BN and aramid. The results show that AP, GP and MP follow the same mechanism, improving the electrical performance by modifying the interface stability and paper structure, and the ranks of improving effects are AP, MP and GP. While, TFO mainly relies on the fluorine components to implement the electrical reinforcement, which compensates for the shortcoming in the paper structure. By choosing TFO and filler content of 15 wt%, the optimal breakdown strength of the paper can be increased to 28.17 kV/mm, 1.8 times that of the paper doped with the hydroxylated BN.

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Section: Introductionmentioning

confidence: 99%

Effect of organophilic group of coupling agent on the electrical performance of Boron Nitride/meta‐aramid composite paper

et al. 2022

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“…The electron‐donating functional groups (amine and hydroxyl groups) could cause changed local density of states, thus increasing conductivity. However, it has been found that methyl side groups have no effect on the energy gap and state density of the anhydride molecule, but carbon–carbon double bonds do markedly 16 . This analysis does not match the test results of DC conductivity.…”

Section: Resultsmentioning

confidence: 67%

“…However, it has been found that methyl side groups have no effect on the energy gap and state density of the anhydride molecule, but carbon-carbon double bonds do markedly. 16 This analysis does not match the test results of DC conductivity. As for different segments, it is found that the presence of aliphatic increases DC conductivity compared to aromatic groups, attributed to the interaction of segment mobility and free volume.…”

Section: Dielectric Propertiesmentioning

confidence: 86%

Effects of cross‐linked networks on dielectric properties of epoxy resins based on molecular dynamics

Wang,

Du,

Kong

et al. 2023

J of Applied Polymer Sci

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In this paper, three epoxy resin systems commonly used in power equipment are prepared to obtain cross‐linked networks with structural differences. The relationship between microscopic structures and dielectric properties of epoxy resins is investigated and discussed. Experimental results show that the polarization and conductance losses are inhibited in the anhydride‐cured systems with methyl groups. The molecular dynamics (MD) simulation shows that rigid anhydride structures (such as methyl groups) play a major role in reducing the local segment mobility and increasing the free volume at cross‐linking points. The decrease in local segment mobility has been confirmed by the decrease of mean square displacement (MSD) at the cross‐linking points, which is consistent with the change of measured polarization and conductance loss. In the glassy state, the dielectric properties of different anhydride‐cured systems can be reflected by local MSD at the cross‐linking points. At high temperatures near the glass transition temperature, both the free volume and network mobility increase significantly, which reflects the increased dielectric relaxation strength and conductance loss. The understanding of the structure–property relationships could provide a theoretical foundation for epoxy modification in a controlled manner for power equipment applications.

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Optimization of Epoxy Resin Crosslinking Network Structures and Control of Electron Transport Behavior Using Chloride Ions

Chen

Liu³

et al. 2023

J. Electron. Mater.

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Effects of Methyl and Carbon-Carbon Double Bond in Anhydride Molecule on Dielectric Properties of Epoxy/Al₂O₃ Composite

Cited by 21 publications

References 22 publications

Effect of organophilic group of coupling agent on the electrical performance of Boron Nitride/meta‐aramid composite paper

Effect of organophilic group of coupling agent on the electrical performance of Boron Nitride/meta‐aramid composite paper

Effects of cross‐linked networks on dielectric properties of epoxy resins based on molecular dynamics

Optimization of Epoxy Resin Crosslinking Network Structures and Control of Electron Transport Behavior Using Chloride Ions

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Effects of Methyl and Carbon-Carbon Double Bond in Anhydride Molecule on Dielectric Properties of Epoxy/Al2O3 Composite

Cited by 21 publications

References 22 publications

Effect of organophilic group of coupling agent on the electrical performance of Boron Nitride/meta‐aramid composite paper

Effect of organophilic group of coupling agent on the electrical performance of Boron Nitride/meta‐aramid composite paper

Effects of cross‐linked networks on dielectric properties of epoxy resins based on molecular dynamics

Optimization of Epoxy Resin Crosslinking Network Structures and Control of Electron Transport Behavior Using Chloride Ions

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Product

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Effects of Methyl and Carbon-Carbon Double Bond in Anhydride Molecule on Dielectric Properties of Epoxy/Al₂O₃ Composite