Effects of minor alloying with Ge and In on the interfacial microstructure between Zn–Sn solder alloy and Cu substrate

Wei, Ying; Liu, Y.; Zhao, Xiuchen; Tan, Chengwen; Dong, Ya-ru; Zhang, Ji

doi:10.1016/j.jallcom.2020.154812

Cited by 19 publications

(6 citation statements)

References 34 publications

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“…The ε-phase transformed into the γ-phase because it is more thermodynamically stable. This is in line with the earlier work of Wei et al [47], who concluded that the ε-phase was consumed by the formation of the γ-one during the aging process. When the Sn content increased from 2.0 to 3 wt.%, the volume fraction of the γ-Cu 5 Zn 8 precipitates increased (see Figure 9), resulting in high reported microhardness values.…”

Section: Resultssupporting

confidence: 93%

Effect of Sn Addition on the Microstructure and Age-Hardening Response of a Zn-4Cu Alloy

Shamaki,

Zahran,

Abd El-Rehim

2023

Crystals

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The aim of this research is to assess the influence of Sn inclusion on the microstructure evolution and age-hardening response of a Zn-4Cu alloy. This is the first study to correlate the age-hardening response to the microstructure of Zn-4Cu alloy reinforced with different Sn contents. A series of Zn-4Cu-Sn alloys were successfully fabricated with different Sn concentrations in the range of 0.0–4.0 wt.% using permanent mold casting. The microstructure of Zn-4Cu-Sn alloys was investigated by means of a scanning electron microscope (SEM) attached with an energy dispersive spectroscope (EDS) and X-ray diffraction (XRD) line profile analysis. At room temperature, the Vickers microhardness measurements were used to assess the age-hardening response of alloys. The results show that the microhardness of the Zn-4Cu (ZC) binary alloy increases a little bit from 76 to 80 HV as the aging time increases from 2 to 128 h, respectively. For aging times up to 16 h, the microhardness of all Sn-containing alloys decreases but then increases again. The lowest hardness belongs to the ZC-1.5Sn alloy, and the Sn-Zn-3.0Sn alloy has the highest; the other alloys fall somewhere in between. At high aging times (64 and 128 h), the microhardness of all Sn-containing samples increased continuously with an increasing Sn content from 0.0 to 3.0 wt.%. When the Sn-containing alloys (3.5 and 4.0 wt.% Sn) were aged for 64 and 128 h, the hardness declined by 7.94% and 8.90% compared to their peak aging hardness values, respectively. By considering the structural changes that occur in the Zn-4Cu-Sn alloys, the reasons for the observed variations in microhardness data with increasing Sn content and aging time were elucidated. X-ray diffraction (XRD) data was analyzed to determine the zinc matrix’s lattice parameters, c/a ratio, and unit cell volume variations.

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Section: Resultssupporting

confidence: 93%

Effect of Sn Addition on the Microstructure and Age-Hardening Response of a Zn-4Cu Alloy

Shamaki,

Zahran,

Abd El-Rehim

2023

Crystals

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“…The lattice misfit can be calculated using the following formula δ = a normalC normalu normalZ normaln 5 − a normalZ normaln a normalC normalu normalZ normaln 5 where δ is the mismatch and a CuZn 5 and a Zn are the lattice constants of CuZn 5 and Zn, respectively. According to the literature, a CuZn 5 is 2.760 Å, and a Zn is 2.664 Å; thus, δ is 3.5% (Figure b). The low lattice mismatch testifies that the semi-coherent phase boundary can form spontaneously, which is energy favorable .…”

Section: Resultsmentioning

confidence: 78%

Texturing Crystal Plane of Zinc Metal via Cleavage Fracture for a Dendrite-Free Zinc Anode

Lai

et al. 2022

ACS Appl. Mater. Interfaces

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The dendrite problem of zinc anodes leads to poor cyclic life and safety hazards, which seriously hinders the development of aqueous zinc-ion batteries (ZIBs). Herein, we propose a new strategy to develop textured zinc anodes with preferential orientation (002) by cleavage fracture along the interface of zinc foil and low lattice mismatched CuZn 5 alloy, which is highly reversible, long-life, and dendrite-free. The sequentially distributed (002) cleavage texture has high surface energy and strong binding energy with zinc atoms, which can significantly reduce the nucleation barrier of zinc and facilitate uniform zinc deposition. Furthermore, the cleavage texture of (002) planes promotes the epitaxial growth of zinc and prevents the dendrite formation. As a result, the zinc anode with the (002) cleavage plane (ZCP (002) ) possesses an ultralong lifetime of about 2500 h in 1 mA cm −2 and 1 mA h cm −2 of symmetric battery and a high average Coulombic efficiency (99.7%) over 925 cycles in ZCP (002) |Cu asymmetric cells. This work provides new insights into modifying metal anodes from the perspective of crystallographic orientation and optimizing zinc anodes for the large-scale application of ZIBs.

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“…38,39) It has also been reported that adding a small amount of Ce to ZnSnCu solder alloys improves the mechanical properties, 40,41) and the addition of Ge and In reduces the growth rate of intermetallic compounds formed at the joining interface between the Cu substrate and the ZnSn solder alloy. 42) ZnNi solder alloys have been developed for high temperature applications. 43,44) The melting point of ZnNi solder with 01.5 mass% Ni is higher than 420°C.…”

Section: A D V a N C E V I E Wmentioning

confidence: 99%

Recent Development of Joining and Conductive Materials for Electronic Components

Kobayashi

Ando

2021

Mater. Trans.

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This study introduces research trends in the electronics materials, such as joining materials including high-temperature lead-free solder, sintered materials using metal particles and transient liquid phase (TLP) materials, and conductive materials such as aluminum and copper alloys. These studies include the content of the special issue published in Materials Transactions (Vol. 57, No. 6 and Vol. 60,No. 6) entitled Frontier Researches Related to Interconnection, Packaging and Microjoining Materials and Microprocessing for Such Materials. It also introduces interesting research contents, leading the development of next-generation electronics.

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Effects of minor alloying with Ge and In on the interfacial microstructure between Zn–Sn solder alloy and Cu substrate

Cited by 19 publications

References 34 publications

Effect of Sn Addition on the Microstructure and Age-Hardening Response of a Zn-4Cu Alloy

Effect of Sn Addition on the Microstructure and Age-Hardening Response of a Zn-4Cu Alloy

Texturing Crystal Plane of Zinc Metal via Cleavage Fracture for a Dendrite-Free Zinc Anode

Recent Development of Joining and Conductive Materials for Electronic Components

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