Effects Of Nickel On The Microstructure And The Mechanical Properties Of Sn-0.7Cu Lead-Free Solders

Gyenes, Anett; Simon, Andrea; Lanszki, Péter; Gácsi, Zoltán

doi:10.1515/amm-2015-0151

Cited by 11 publications

(9 citation statements)

References 18 publications

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“…Similar microhardness ($11.96 HV) of Sn-0.7Cu alloy was reported by Mohd Salleh et al (2012). However, a slightly lower microhardness (<12 HV) of bulk Sn-0.7Cu alloy has also been reported by other researchers (Gyenes et al, 2015;Zhao et al, 2019). A slight increment in hardness, i.e.…”

Section: Microhardnesssupporting

confidence: 84%

Pulse plated Sn-Cu solder coatings from stannate bath

Sharma

Ahn

2019

SSMT

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Purpose The purpose of this paper is to investigate the influence of pulse plating current density on the morphology and solderability of Pb-free Sn-Cu solder coatings prepared from alkaline stannate baths. Design/methodology/approach Sn-Cu solder coatings were produced from a plating solution containing sodium stannate, copper stannate, sodium hydroxide and sorbitol additive on copper substrates. The pulse plating experiments were conducted in galvanostatic mode. The plating current density was varied from 5 to 25 mA/cm2, and the morphology of the coatings was studied. The solderability of the coatings was assessed by spread ratio measurement after reflowing the solder coatings at 250°C. Findings The composition control of eutectic solders is always a challenge in plating. The findings show that Sn-Cu coatings prepared by pulse plating are composed of tetragonal ß-Sn structure and Cu6Sn5 compounds irrespective of bath composition and conditions. The final coatings were very dense and smooth with nodular morphology. It was shown that a eutectic composition can be achieved if we apply a current density of ∼15-20 mA/cm2. The solderability studies suggest that solder coatings plated at and beyond 15 mA/cm2 are more suitable for solder finish applications. Originality/value The work presents key issues in pulse electroplating of Sn-Cu solder coatings from an alkaline bath. Possible strategies to control the eutectic Sn-Cu composition by plating process are recommended.

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Section: Microhardnesssupporting

confidence: 84%

Pulse plated Sn-Cu solder coatings from stannate bath

Sharma

Ahn

2019

SSMT

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“…Owing to the larger tip size of the Vickers method (200 nm), a higher load is commonly needed (Cagliero and Maizza, 2011). Recent measurements involved loading values such as 25 g (Negm et al, 2010), 100 g (Chen et al, 2016b), 300 g (Hu et al, 2013, Gyenes et al, 2015 and 10 gf (Chen et al, 2012). Additionally, a shorter dwell time (10-20 s) was sufficient for the indentation, as the lead-free solders were easily deformed (Chen et al, 2012;Tsao et al, 2016).…”

Section: Vickers Hardness Testmentioning

confidence: 99%

“…The approach of characterizing lead-free solders in the bulk form is practical for certain research studies which involve (Tsao et al, 2016;Gyenes et al, 2015) the following:…”

Section: Hardness Of Bulk Solder Alloymentioning

confidence: 99%

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Hardness testing of lead-free solders: a review

Yahaya

Mohamad

2017

SSMT

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Purpose This paper aims to cover the recent (2010-2016) techniques for carrying out hardness evaluation on lead-free solders. Details testing configuration/design were compiled and discussed accordingly to each of the measurement techniques: Vickers microhardness, Brinell microhardness and nanoindentation. Design/methodology/approach A brief introduction on lead-free solders and the concept of hardness testing has been described at the beginning of the review. Equipment setup, capabilities, test configuration and outcomes were presented for each technique and discussed in parallel along with the case studies from selected articles. Findings Comparison, outcomes and insight regarding each of the methods were highlighted to observe the recent trends, scientific challenges, limitations and probable breakthroughs of the particular hardness testing methods. Originality/value The compilation of latest reports, technical setup plus with the critics and perception from the authors are the main key value in this review. This provides an in-depth understanding and guidance for conducting hardness evaluation on lead-free solders.

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“…The effect 0.08 wt.% Ni-addition on the microstructure and the mechanical properties of Sn-0.7 Cu alloy has been studied by Gyenes et. al [16]. They found that Sn-0.7 Cu-Ni alloy becomes fully eutectic [β-Sn + (Cu,Ni) 6 Sn 5 ], and the ultimate tensile strength (UTS), yield strength (YS) and hardness (HV) were increased.…”

Section: Introductionmentioning

confidence: 99%

Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder

Yassin

2019

Arab Journal of Nuclear Sciences and Applications

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The effects of Zn and Sb additions on microstructure, creep behavior and thermal properties of binary eutectic Sn-0.7% Cu lead-free solder were investigated. Results show that Zn-addition reduced the melting temperature of Sn-0.7Cu and enhanced the creep resistance due to the formation of Cu 5 Zn 8 intermetallic compound (IMC) and reduction of Cu 6 Sn 5 phase in β-Sn matrix. Conversely, the Sbaddition showed a negative effect on both the creep resistance and melting temperature compared to the plain Sn-0.7 Cu and Sn-0.7 Cu-2.0 Zn alloys due to the formation of SnSb IMC particles and coarse Cu 6 Sn 5 phase through the β-Sn rich phase. The average stress exponents of 4.9-6.0 and activation energies of 50-60 KJ/mol were obtained for three solders; suggesting that the dislocation climb controlled by lattice diffusion is the dominant creep mechanism. X-ray diffraction (XRD) analysis revealed that the lattice parameters (a), (c), the axial rate (c/a) and the peak height intensities (hkl) of some crystallographic planes are changed with alloying additions and the crystallite size is decreased.

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Effects Of Nickel On The Microstructure And The Mechanical Properties Of Sn-0.7Cu Lead-Free Solders

Cited by 11 publications

References 18 publications

Pulse plated Sn-Cu solder coatings from stannate bath

Pulse plated Sn-Cu solder coatings from stannate bath

Hardness testing of lead-free solders: a review

Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder

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