Reactive high-power impulse magnetron sputtering was used to deposit HfO 2 films on Si substrates using a voltage pulse duration, t 1 , from 100 to 200 µs and an deposition-averaged target power density, , from 7.2 to 54 Wcm-2. The effects of these processing parameters on the microstructure and properties of the films were studied by atomic force microscopy, nanoindentation, X-ray diffraction, electron diffraction and high-resolution transmission electron microscopy. Four HfO 2 films were prepared with (1) t 1 = 100 µs, = 7.2 Wcm-2 (T100S7), (2) t 1 = 200 µs, = 7.3 Wcm-2 (T200S7), (3) t 1 = 200 µs, = 18 Wcm-2 (T200S18) and (4) t 1 = 200 µs, = 54 Wcm-2 (T200S54). All films were found to be composed of an interlayer next to the Si interface followed by a nano-columnar structure layer. The interlayer structure of the films was found to contain a population of lower density nanoscale regions. A reduction in in films T200S54, T200S18, T200S7 and T100S7 caused an increase in the interlayer thickness and a decrease in the width of the nano-columnar structures from ~46 nm to ~21 nm. This microstructural change was accompanied by a concomitant change of the grain boundary