Jpn. J. Appl. Phys.
 2011
DOI: 10.7567/jjap.50.076501
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Effects of Post-SiH4and Plasma Treatments on Chemical Vapor Deposited Cu Seeds with Chemical Vapor Deposited TiN Barrier in Porous Low Dielectric Constant and Cu Integration

Sung Gyu Pyo
1
,
Shangkyun Park
2
,
Hansoo Park
3
et al.
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