Effects of postcure temperature on mechanical properties of resin mineral composite for precision machine tool

Abstract

Resin mineral composite has drawn much attention in the field of elementary machine components due to its excellent damping property. The effects of postcure temperature on mechanical properties of resin mineral composite were investigated in this paper. Research results showed that the glass-transition temperature of resin matrix, the surface hardness of resin matrix, the compressive strength of resin matrix, and the compressive strength of resin mineral composite increased with the increasing postcure temperature. If the postcure temperature increased from 30℃ to 120℃, the compressive strength of resin mineral composite increased by 17.34%, the compressive strength of resin matrix increased by 6.67%, the surface hardness of resin matrix increased by 54.16%, and the glass-transition temperature of resin matrix increased by 49.09%. The postcure process at 120℃ for 4 hours can be used to improve the mechanical properties as a mature post-treatment technology for resin mineral composite. Good correlations were obtained between glass-transition temperature of resin matrix and surface hardness of resin matrix, compressive strength of resin matrix, and compressive strength of resin mineral composite. The correlations showed that the glass-transition temperature of resin matrix can be used to define and monitor the mechanical properties of resin mineral composite.

The thermal expansion behaviour of carbon fiber-reinforced resin mineral composite postcured under various temperatures

“…A variety of postcure temperatures can effectively change the T g of matrix and mechanical properties of RMC. 21 Wei et al 22 found that addition of carbon nanotubes to a polymer matrix would increase the glass transition temperature (T g ) and thermal expansion and duffusion coefficients in the composite above T g . Wong and Bollampally 23 studied the CTE of polymer composite filled with ceramic particles for electronic packaging.…”