Effects of Preparation Methods for Cu Foil on the Electric‐Explosion Properties

Abstract

In order to study the different structural characteristics and electric explosion properties of Cu foils prepared by different methods, Cu films were prepared by electron beam evaporation, electroplating, evaporation, and magnetron sputtering in this work. The morphology and structure of the Cu films were characterized by SEM, AFM, XRD. Furtherly, the Cu films were separately etched into a bridge foil shape to measure the explosion process of the Cu foil in the discharge circuit at the charging voltage of 3000 V, and the resistance and deposition energy were calculated. The results showed that the particle size and surface roughness of Cu foil prepared by evaporation was smallest, and the crystallization peak of Cu (111) texture was strongest. The surface roughness of the Cu foil prepared by magnetron sputtering was the largest, and the peak voltage was the highest of 1640 V. The Cu foil prepared by electroplating had the smallest initial resistance and the longest time to reach the peak resistance during the explosion process. The deposition energy of the Cu film is 93.37 mJ, which is the largest. Among these methods, the Cu foil prepared by electroplating is more conducive to energy conversion.

The Overlooked Role of Copper Surface Texture in Electrodeposition of Lithium Revealed by Electron Backscatter Diffraction

“…Cu foils are wildly used in batteries, electromagnetic shielding, and integrated circuits because of their high electrical conductivity and tensile strength. − In the current Li-ion batteries, the Cu foil functions as the current collector for the graphite-based anode. In order to increase the gravimetric energy density of the batteries, the thickness of the Cu foil has been reduced down to below 10 μm recently (i.e., the ultrathin Cu foil), which nevertheless leads to challenges in maintaining sufficient mechanical strength and corrosion resistance.…”