“…[14,15] The most often used techniques for depositing LaF 3 thin films have been physical vapor deposition (PVD) methods, e.g., electron-beam evaporation (EBE), [4,11,[16][17][18][19][20][21][22] ion-assisted deposition, [5,7,13,23] thermal evaporation, [3,[6][7][8]12,16,18,[24][25][26][27][28][29][30][31][32][33][34] ionbeam sputtering, [7,18,28] radio frequency magnetron sputtering, [35,36] and molecular beam epitaxy. [37][38][39][40][41] Only a few CVD methods have been used for depositing LaF 3 thin films, i.e., pyrolysis of a single source precursor La(hfa) 3 diglyme complex (hfa ¼ hexafluoroacetylacetonate), [42] or by using HF or NF 3 as a fluorinating agent. [43] Atomic layer deposition (ALD), a special variant of the CVD method, is based on the film growth through alternate saturative surface reactions.…”