Effects of Sb addition on tensile strength of Sn–3.5Ag–0.7Cu solder alloy and joint

Li, G.Y.; Chen, B.L.; Shi, Xu; Wong, Stephen Chee Khuen; Wang, Z.F.

doi:10.1016/j.tsf.2005.09.060

Cited by 54 publications

(26 citation statements)

References 8 publications

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“…When the solder is applied to stresses, the dislocations slip on the slip plane to resist the deformation. 25 The SAC (205)-0.05Ni alloy exhibits the highest tensile strength over the strain rate range. This can be attributed to the formation of (Cu,Ni) 6 Sn 5 IMCs in the solder matrix and the refinement of b-Sn matrix as well as the sizes of the IMC particles.…”

Section: Influence Of Strain Rate On the Mechanical Propertiesmentioning

confidence: 97%

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Hammad

El-Taher

2014

Journal of Elec Materi

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The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni) 6 Sn 5 intermetallic compounds (IMCs) inside the b-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni) 6 Sn 5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)-and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

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Section: Influence Of Strain Rate On the Mechanical Propertiesmentioning

confidence: 97%

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Hammad

El-Taher

2014

Journal of Elec Materi

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“…It can be seen that with increasing aging time, the tensile strength gradually decreases, but the decrease degree is very small. However, when the substrate is copper, the tensile strength of the Sn-Ag-Cu/Cu joint decreases dramatically [36]. The reason may be that the residual stress at the Sn-Ag-Cu/Cu joint interface is higher than that of the Sn-Ag-Cu/Ag joint interface.…”

Section: Microstructure Evolution Of the Imcs Under Isothermal Liquidmentioning

confidence: 99%

“…Normally, there are two kinds of fracture modes in the joint samples, i.e. step fracture and flat fracture [36], as shown in Fig. 9(a) and (b).…”

Section: Microstructure Evolution Of the Imcs Under Isothermal Liquidmentioning

confidence: 99%

Growth kinetics of intermetallic compounds and tensile properties of Sn–Ag–Cu/Ag single crystal joint

Zou

Zhu

Zhang

2008

Journal of Alloys and Compounds

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“…Many studies performed on the improvement of the mechanical properties by finer lamellar structures are reported in the literature [1][2][3][4][5][6][7][8]. Recently, some studies have concentrated on the ternary and multicomponent alloy systems [9][10][11][12]. As a ternary eutectic alloy, the Sn-Pb-Sb ternary system is technologically important for soldering applications.…”

Section: Introductionmentioning

confidence: 99%

Characterization of a Directionally Solidified Sn–Pb–Sb Ternary Eutectic Alloy

Çadırlı

Şahin

Turgut

2015

Metallogr. Microstruct. Anal.

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A Sn-40.5wt%Pb-2.6wt%Sb ternary eutectic alloy was prepared using a vacuum melting furnace and a casting furnace. The samples were directionally solidified at a constant growth rate (V = 16.5 lm/s) under different temperature gradients (G = 1.05-3.88 K/mm) and at a constant temperature gradient (G = 3.88 K/mm) under different growth rates (V = 8.3-498 lm/s). The effects of G and V on lamellar spacing (k), microhardness (HV), and ultimate tensile strength (r) were determined. The lamellar spacing and microhardness were measured from both longitudinal and transverse sections of the sample. The relationships between solidification parameters (G, V), microstructure parameters (k L , k T ), and mechanical properties (HV, r) were determined from linear regression analysis. It was found that the microhardness and tensile strength increase with increasing G and V as well as with decreasing k.

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Effects of Sb addition on tensile strength of Sn–3.5Ag–0.7Cu solder alloy and joint

Cited by 54 publications

References 8 publications

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Growth kinetics of intermetallic compounds and tensile properties of Sn–Ag–Cu/Ag single crystal joint

Characterization of a Directionally Solidified Sn–Pb–Sb Ternary Eutectic Alloy

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