Effects of Spark Plasma Sintering Parameters on Microstructure and Properties of Al–50 wt.% Si Alloys

Gao, Chong; Niu, Li-Bin; Ma, Li; Haoxuan, Huang; Ma, Jun; An, Yu-jiao; Hu, Yuyang

doi:10.1007/s11106-022-00268-y

Cited by 5 publications

(1 citation statement)

References 13 publications

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“…The influences of adding diamond [19][20][21][22][23][24], TiC [17], Si 3 N 4 [25], cBN [16], or SiC [10,18,[26][27][28] via different techniques on the thermal behaviors of aluminum matrix composites were deeply studied. Recently, Si particles were suggested to be a potential additive for aluminum matrix composites due to their low coefficients of thermal expansion, high thermal conductivity and low density [7][8][9]15,[29][30][31]. Moreover, superior to other ceramic additives like SiC, diamond and Si 3 N 4 , Al/Si composites demonstrate a much lower cost and good recyclability, since Al/Si composites can be recycled and processed into Al-Si alloys, which are a series of cast Al alloys widely used in the structural parts of machines.…”

Section: Introductionmentioning

confidence: 99%

Facile Synthesis and the Thermal Properties of Al/Si Composites Prepared via Fast Hot-Pressing Sintering

Jia,

Hei,

et al. 2023

Metals

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In this paper, a novel power sintering technique, named fast hot-pressing sintering (FHP), which is able to achieve an ultrahigh heating rate similar to the spark plasma sintering (SPS) technique, but at a much lower cost, was applied to prepare a series of Al/Si composites with different Si volume ratios (12 vol.% to 70 vol.%) to meet the requirements of advanced packaging materials for electronic devices. In contrast to SPS, the FHP oven possesses a safe and budget-friendly current power supply, rather than a complex and expensive pulse power supply, for its heating power. The optimized sintering parameters (temperature, pressure and holding time) of FHP for preparing Al/Si composites were investigated and determined as 470 °C, 300 MPa and 5 min, respectively. In order to characterize the potential of Al/Si composites as packaging materials, thermal conductivities and coefficients of thermal expansion were studied. The thermal conductivity of the Al-40Si composite sintered by the FHP method is higher than that of the conventional SPS method (139 to 107 W m−1 K−1). With the increase in Si, the thermal conductivities and coefficients of thermal expansion on both decreases. Furthermore, the thermal conductivities obey the Agari model, whereas the coefficient of thermal expansion and Si volume ratios obey additivity. The numeric modeling would help develop required packaging materials based on the thermal performances of the substrate materials, like Si or GaAs semiconductor devices.

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