2016
DOI: 10.1016/j.matlet.2016.02.100
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Effects of sputtering and assisting ions on the orientation of titanium nitride films fabricated by ion beam assisted sputtering deposition from metal target

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Cited by 24 publications
(12 citation statements)
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“…Among the "bottom up" techniques such ones as: ion [31,32] and magnetron sputtering [33,34], ion implantation [35,36], plasma techniques [37,38] and chemical methods [39] should be distinguished for their advantageous application to the development of nano-sized materials. These methods consist in transiting the material from its solid state (referred to as a target) into the gaseous phase followed by its deposition onto the substrate.…”
Section: Introductionmentioning
confidence: 99%
“…Among the "bottom up" techniques such ones as: ion [31,32] and magnetron sputtering [33,34], ion implantation [35,36], plasma techniques [37,38] and chemical methods [39] should be distinguished for their advantageous application to the development of nano-sized materials. These methods consist in transiting the material from its solid state (referred to as a target) into the gaseous phase followed by its deposition onto the substrate.…”
Section: Introductionmentioning
confidence: 99%
“…No other characteristic diffraction peak exists in the patterns. It can be concluded that the films are B1-structured and the preferred orientation is (111), which has growth advantages [ 10 ]. The results show that all the (Ti, Zr)N films exist as a kind of solid solution, in which the Ti and Zr atoms are distributed in a rocksalt crystal structure with a certain degree of uniformity.…”
Section: Resultsmentioning
confidence: 99%
“…Titanium nitride and zirconium nitride are the most studied nitrides for its high conductivity, chemical stability and high melting point. The electronic and optical properties of B1-structured nitrides can be tuned by their composition for their nonstoichiometry [ 10 , 11 , 12 , 13 , 14 ]. Recent studies have shown the versatility of nitride plasmonic materials [ 15 ].…”
Section: Introductionmentioning
confidence: 99%
“…Today TiN has already received extensive applications, ranging from hard and protective coating in ornament industry to diffusion barrier layers in semiconductor industry [10]. Besides above applications, TiN has also been adopted as the main constituent of the heater for phase-change random access memory (PCRAM) during last decade [11,12].…”
Section: Methodsmentioning
confidence: 99%