Effects of stress on the interfacial reactions of metal thin films on (001)Si

Cheng, Sheng-Tzong; Lo, H.M.; Li, Cheng; Chang, Shu‐Hao; Chen, L.J.

doi:10.1016/s0040-6090(02)00902-1

Cited by 8 publications

(1 citation statement)

References 17 publications

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“…Stresses are often induced by thermal changes and the different coefficients of thermal expansion in a multilayer film system. They are also induced by a lattice mismatch in a system consisting of a film and a substrate, [1][2][3][4] can result in the deformation of the film structure, and then affect optical transmission characteristics. In addition, failures including delamination and cracking may occur when a laser induces a thermal-mechanics coupling effect, particularly at high temperatures.…”

Section: Introductionmentioning

confidence: 99%

Thermoviscoelastic Analysis of Polymeric Film on an Elastic Substrate with Graded Interlayer

Chang¹,

Fang²,

Yang³

2007

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A viscoelastic analysis of thermal stress in a polymeric film with a graded interlayer is presented. In this analysis, the material properties of the graded interlayer are assumed to change linearly from the substrate used to the film. Viscoelastic field was calculated utilizing a Laplace transform and then the viscoelastic stress of the film in a Laplace transform space was analytically inverted to obtain a time domain and to yield an expression as a function of relaxation time and elastic modulus and thickness ratios for the film, graded interlayer, and substrate. On the basis of the results of our analysis, the stress of the film rapidly decreased as the normalized times of the film increased. The effect of the ratio of film thickness to graded interlayer thickness was an increase in film stress as the ratio of substrate thickness to graded interlayer thickness decreased. As the ratio of film thickness to the graded interlayer thickness increased, the rate of stress relaxation decreased. Furthermore, as the ratio of film elastic modulus to the substrate elastic modulus increased, the rate of stress relaxation also decreased.

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Section: Introductionmentioning

confidence: 99%

Thermoviscoelastic Analysis of Polymeric Film on an Elastic Substrate with Graded Interlayer

Chang¹,

Fang²,

Yang³

2007

jjap

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Amorphisation at Heterophase Interfaces

Gemming

Enyashin

Schreiber

Lecture Notes in Computational Science and Engineering

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On the interplay of internal/external stress and thermal stability of Mo/Si multilayers

Leisegang

Meyer

Levin

et al. 2003

Applied Physics A: Materials Science & Processing

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Mo/Si multilayer (ML) systems were deposited on Si(100) substrate by DC magnetron sputtering. The MLs were annealed at temperatures up to 440 degreesC under high-vacuum conditions, both with and without the influence of external mechanical stress, and characterized before and after thermal treatment by means of X-ray reflectometry, wide-angle X-ray scattering and optical microscopy. Two ML configurations were compared, one composed of pure Mo and Si layers and another with additional B4C and C interlayers at the Mo/Si interfaces, respectively. The external mechanical stress applied caused bending of the substrate and adherent ML, with an accompanied internal stress of approximately 60 GPa. An important outcome of the investigation was that dedicated release bending of MLs can reduce/compensate the influences of the internal stressed states. Thermal stability could be increased for both ML systems during sample annealing. For ML samples with additional B4C and C layers at the Mo/Si interfaces, the influence of external stress was more significant compared to that for pure Mo/Si MLs. This indicates that the additional layers mainly act as diffusion barriers and additionally as stress-relaxing buffers

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Effects of stress on the interfacial reactions of metal thin films on (001)Si

Cited by 8 publications

References 17 publications

Thermoviscoelastic Analysis of Polymeric Film on an Elastic Substrate with Graded Interlayer

Thermoviscoelastic Analysis of Polymeric Film on an Elastic Substrate with Graded Interlayer

Amorphisation at Heterophase Interfaces

On the interplay of internal/external stress and thermal stability of Mo/Si multilayers

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