1984
DOI: 10.1016/0040-6090(84)90003-8
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Effects of substrate temperature and substrate material on the structure of reactively sputtered TiN films

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Cited by 81 publications
(12 citation statements)
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“…Therefore, the film exhibits a lower hardness value. As the pulse bias voltage is applied, the ion bombarding energy increases which makes the crystal size smaller and the films dense [13,14]. Therefore, the hardness of the film tends to increase.…”
Section: Mechanical Propertiesmentioning
confidence: 97%
“…Therefore, the film exhibits a lower hardness value. As the pulse bias voltage is applied, the ion bombarding energy increases which makes the crystal size smaller and the films dense [13,14]. Therefore, the hardness of the film tends to increase.…”
Section: Mechanical Propertiesmentioning
confidence: 97%
“…The reduction in TiN density results from the presence of hydrogen (6% of film composition) disrupting the Ti-N network bonding, leading to the decreased elastic properties compared to cubic single crystal TiN (Table II). The elastic constants and moduli of the TiN layers also depend on growth conditions such as the ratio of gases, 30 bias potential, 31,32 temperature, 33 defects, 34 and substrate material. 35 In addition, compositional variations, particularly the evolution of an interfacial TiO layer during sputter deposition 35 or variations in nitrogen content, can affect the mechanical properties of thinner films.…”
Section: A Low-k Sioch:tin Structuresmentioning
confidence: 99%
“…The TiN films were grown using reactive magnetron sputtering to a thickness of 4 pm. The process used for depositing these films has been described in detail elsewhere (Helmersson et al, 1985;Hibbs et al, 1984) but a brief description can also be found in the Results section of this paper.…”
Section: Mechanical Handling and Thinningmentioning
confidence: 99%