Effects of suppressors on the incorporation of impurities and microstructural evolution of electrodeposited Cu solder joints

Su, Yan–Kuin; Tsai, Kun-Lin; Li, Yu-Ju; Chen, Chih‐Ming

doi:10.1016/j.jtice.2023.104956

Cited by 7 publications

(1 citation statement)

References 50 publications

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“…The surface profiles of the two Cu electroplated layers were also analyzed using a profilometer, as shown in Figure 1c,d, and the results were consistent with the top-view SEM observations. Such a significant morphological change is attributed to the synergistic effect generated by the interactions between the suppressor and accelerator molecules being simultaneously adsorbed on the Cu surface, which regulates the atomic deposition [29,[32][33][34]. The grain size distribution was not uniform in the two Cu electroplated layers, as shown in Figure 2c,d.…”

Section: Effects Of Additives On Co-deposition Of Impurities In Elect...mentioning

confidence: 98%

Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu

Li,

Yen,

Chen

2024

Materials

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Sn-3Ag-0.5Cu (SAC305)- and Sn-9Zn-based alloys (Sn-Zn-X, X = Al, In) are lead-free solders used in the fabrication of solder joints with Cu metallization. Electroplating is a facile technology used to fabricate Cu metallization. However, the addition of functional additive molecules in the plating solution may result in impurity residues in the Cu electroplated layer, causing damage to the solder joints. This study investigates the impurity effect on solder joints constructed by joining various solder alloys to the Cu electroplated layers. Functional additives are formulated to fabricate high-impurity and low-impurity Cu electroplated samples. The as-joined solder joint samples are thermally aged at 120 °C and 170 °C to explore the interfacial reactions between solder alloys and Cu. The results show that the impurity effect on the interfacial reactions between SAC305 and Cu is significant. Voids are massively formed at the SAC305/Cu interface incorporated with a high impurity content, and the Cu6Sn5 intermetallic compound (IMC) grows at a faster rate. In contrast, the growth of the Cu5Zn8 IMC formed in the SnZn-based solder joints is not significantly influenced by the impurity content in the Cu electroplated layers. Voids are not observed in the SnZn-based solder joints regardless of the impurity content, indicative of an insignificant impurity effect. The discrepancy of the impurity effect is rationalized by the differences in the IMC formation and associated atomic interdiffusion in the SAC305- and SnZn-based solder joints.

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Section: Effects Of Additives On Co-deposition Of Impurities In Elect...mentioning

confidence: 98%

Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu

Li,

Yen,

Chen

2024

Materials

Self Cite

View full text Add to dashboard Cite

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Investigation on synthesis and mechanism of a Sudan Ⅰ copper electrodeposition leveler based on influencing ion diffusion strategy

Zhou,

Yuan,

et al. 2024

Dyes and Pigments

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Synergistic effects of additives on impurity residues in high-speed copper electrodeposition and voiding propensity in solder joints

Tsai,

Chen,

2024

Journal of the Taiwan Institute of Chemical Engineers

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Effects of suppressors on the incorporation of impurities and microstructural evolution of electrodeposited Cu solder joints

Cited by 7 publications

References 50 publications

Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu

Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu

Investigation on synthesis and mechanism of a Sudan Ⅰ copper electrodeposition leveler based on influencing ion diffusion strategy

Synergistic effects of additives on impurity residues in high-speed copper electrodeposition and voiding propensity in solder joints

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