Effects of surface chemistry on thermal conductance at aluminum–diamond interfaces

Abstract

Articles you may be interested inEffect of van der Waals forces on thermal conductance at the interface of a single-wall carbon nanotube array and silicon AIP Advances 4, 127118 (2014); 10.1063/1.4904099 Influence of diamond surface termination on thermal boundary conductance between Al and diamondSynthetic diamond has potential as a heat spreading material in small-scale devices. Here, we report thermal conductance values at interfaces between aluminum and diamond with various surface terminations over a range of temperatures from 88 to 300 K. We find that conductance at oxygenated diamond interfaces is roughly four times higher than at hydrogen-treated diamond interfaces. Furthermore, we find that Al grain structure formation is not strongly dependent on diamond surface chemistry, which suggests that interfacial bonding influences thermal conductance. The results reported here will be useful for device design and for advancing models of interfacial heat flow.

Influence of diamond surface termination on thermal boundary conductance between Al and diamond

“…This result confirms the tendency reported by Collins et al 9 , though with absolute values higher by a factor of 2. This might be owed to the use of different ways of oxidizing the surface since acid and plasma treatment was used, not heating in an oxygen-rich atmosphere 48 .…”

“…Finally, Hopkins et al 10 recently reproduced this result with graphene instead of diamond and observed the same trends as Collins et al. In this paper, we extend the work by Collins et al 9 and we present a thorough investigation of the effect of various surface treatments on the Al/diamond TBC. The treatments that we apply to the diamond surface consist in the exposure to a plasma of pure argon, argon:hydrogen, or argon:oxygen, as well as a a mix of acids, along with the reference of an as-polished diamond.…”

“…Recently, Losego et al 8 showed that the functionalization of a silicon dioxide surface with polymers can change substantially both the adhesion and the TBC with a gold layer. Collins et al 9 found that oxygenation and hydrogenation of diamond change the TBC between Al and diamond, to higher values for the former and lower for the latter. Finally, Hopkins et al 10 recently reproduced this result with graphene instead of diamond and observed the same trends as Collins et al.…”

Qualitative link between work of adhesion and thermal conductance of metal/diamond interfaces

“…the TBC is mainly governed by properties of the materials on either side of the interface, but several features of the interface itself can also have a substantial influence on the resulting performance. Examples of such features include: intermixing between the layer and substrate 11 , ion bombardment of the interface 12,13 , roughness 14,15 and chemical termination of the substrate [16][17][18][19] , all of which have an impact on the TBC. Recently, Losego et al showed that there is a link between the chemical bonding at an interface between gold and quartz and the TBC of this interface by adding Self Assembled Monolayers (SAMs) between these two materials 20 .…”

On critical aspects of infiltrated Al/diamond composites for thermal management: Diamond quality versus processing conditions

“…The effect of diamond surface characteristics on the thermal conductance of the diamond-metal interface and the thermal conductivity of the final composite materials has also been proved to be important. Oxygenated diamond samples have roughly thermal interface conductance with Al four times higher than hydrogen-treated samples [20]. Different metallic coatings have been used to effectively increase the interfacial thermal conductance [21][22][23].…”