“…Two approaches for using molecular precursors to generate alkyl groups on metal surfaces. I/TPD 140 CH3Cl TPD, 398 UPS, 398 HREELS 398 CH2I2 TPD, 140,236 H/TPD, 140 CD3/TPD 140,236,251 CH3CH2I TPD 75,251 CH3CH2CH2I, CH3CD2CH2I TPD, 75,236,245a IR 245a CH3CHICH3 IR 245a CH3(CH2)3I TPD, 75 is kinetically favored over C-H bond scission (see Table 4). In almost every case, carbon-iodine bond scission occurs at or below 200 K, while C-H bond scission in alkyl groups occurs above 200 K. The net result is selective cleavage of the C-X bond to generate the desired fragment.…”