Effects of Surface Finish, Heat Treatment and Cold Working on the Wettability of Solid Copper by Liquid Tin

Abstract

The sessile drop method was used to study the effects of surface finish, heat treatment and cold working on the wettability of solid Cu by liquid Sn. Wettability was evaluated by measuring the angle of contact between the solid and the liquid phases. It was found that electrolytic polishing is better for obtaining good wetting than mechanical polishing. It was . also indicated that annealing of solid Cu substracts could promote the wettability depending on the annealing period. Cold working was also found to have an influential effect on the wettability depending on the process and the degree of cold working. (Rolling promotes the wetting by decreasing the value of the contact angle of both mechanically and electrolytically polished Cu substrates, while pressing does not cause a significant effect on the contact angle of the mechanically polished samples but has an influential effect on the contact angle of the electrolytically polished samples). These results were discussed in relation to the crystal orientation and surface energy of the solid Cu substrates.

Preparation of CoNi high surface area porous foams by substrate controlled electrodeposition

“…The contact angle of the PC substrate is lower since the randomly oriented grains have for statistical reasons predominantly orientations in the middle of the orientation triangle and only in rare cases orientations of low index planes with low surface energies. This is supported by the results by Hasouna et al 20 reporting that in a strongly textured polycrystalline Cu having grains with their surfaces predominantly oriented parallel (111) the contact angle increases.…”

“…According to the Young equation the ratio between them determines the contact angle. 20 g SG = g SL + g LG cos y CA A contact angle (y CA ) less than 901 for water indicates hydrophilic and higher than 901 hydrophobic surfaces. Fig.…”