Effects of Surface Finish on the Shear Fatigue of SAC-Based Solder Alloys

Su, Sinan; Jian, Minghong; Hamasha, Sa’d

doi:10.1109/tcpmt.2019.2942806

Cited by 17 publications

(8 citation statements)

References 36 publications

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“…However, this study did not address the impacts of aging. Sinan et al [ 16 ] investigated the fatigue behavior of individual solder joints. The results showed that the fatigue resistance of the organic solderability preserve (OSP) and immersion silver (ImAg) surface finishes for the SAC-Bi solder joints surpassed the ENIG surface finish.…”

Section: Introductionmentioning

confidence: 99%

“…After revising the published papers, it can be concluded that adding Ag in solder alloys was found to provide enhanced mechanical and fatigue properties [ 11 , 16 ]. However, the drop shock test indicated the detrimental effect of Ag with the reduction in the ductility [ 12 ].…”

Section: Introductionmentioning

confidence: 99%

“…However, the drop shock test indicated the detrimental effect of Ag with the reduction in the ductility [ 12 ]. The other micro-alloying elements, such as Bi, Ni, and Sb, were also reported to improve the reliability of solder joints [ 2 , 6 , 16 ]. Meanwhile, these elements could prevent the degradation of properties during aging [ 6 , 14 , 15 ].…”

Section: Introductionmentioning

confidence: 99%

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The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys

et al. 2022

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The surface finish (SF) becomes a part of the solder joint during assembly and improves the component’s reliability. Furthermore, the SF influences the solder joint’s reliability by affecting the thickness of the intermetallic compound (IMC) layer at the solder interface and copper pads. In this experiment, five different alloys are used and compared with the SAC305 alloy, two of which, Innolot and SAC-Bi, are bi-based solder alloys. This study includes three common SFs: electroless nickel immersion gold (ENIG), immersion silver (ImAg), and organic solderability preserve (OSP). The performance of three surface finishes is examined in terms of component characteristic life. All of the boards were isothermally aged for twelve months at 125 °C. The boards were then exposed to 5000 cycles of thermal cycling at temperatures ranging from −40–+125 °C. Most of the current research considers only one or two factors affecting the reliability of the electronic package. This study combines the effect of multiple factors, including solder paste content, SF, isothermal aging, and thermal cycling, to ensure that the test conditions represent real-world applications. In addition, the electronics packages are assembled using commercialized alloys. The current study focuses on a high-performance alloy already present in the electronic market. The failure data were analyzed statistically using the Weibull distribution and design of experiments (DOE) analysis of variance (ANOVA) techniques. The findings reveal that the micro and uniformly distributed precipitates in solder microstructures are critical for high-reliability solder joints. Re-crystallization of the thermally cycled solder joints promotes the local formation of numerous new grains in stress-concentrated zones. As the fracture spreads along these grain boundaries and eventually fails, these new grains participate in crack propagation. Aging significantly worsens this situation. Finally, although the ENIG surface finish with its Ni layer outperforms other SFs, this does not imply that ENIG is more reliable in all solder paste/sphere/finish combinations.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys

et al. 2022

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“…Furthermore, the packaging stage also includes various thermal processes such as chip assembly, wire bonding, flip chip bonding, mold cure, and soldering. Many reliability defects are caused by the low stiffness and warpage of the substrate resulting from thermal processes, such as underfill, detachment and crack of solder joints, and disconnection of the solder joint [ 4 , 5 ]. Thus, the warpage of the substrate is known as the fundamental cause of such reliability issues [ 6 , 7 , 8 , 9 , 10 , 11 , 12 ].…”

Section: Introductionmentioning

confidence: 99%

Study on Effects of Nonlinear Behavior Characteristics of Prepreg Dielectric on Warpage of Substrate under Laminating Process

Cho

2022

Polymers

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To analyze the effects of nonlinear behavior characteristics of prepreg (PPG) among the insulating materials of substrate and the residual stress of laminating process on the warpage of substrate, this study investigated the continuous laminating process using the numerical analysis by finite element method. The analysis results showed that the warpage of the substrate in the laminating process of PPG was very low, but it increased rapidly in the solder resist (SR) laminating process. As the laminating process of PPG continued, the stress inside the substrate increased continuously and it was predicted to decrease in the SR laminating process. These results confirmed that the warpage of the substrate is influenced the most by the SR laminating process, and that the warpage and stress of substrate accumulated in the laminating process of PPG have significant effects on the final warpage.

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“…The solder wetting without using very aggressive flux is impossible in the case of exceeding oxide thickness threshold [ 25 ]. Surface finish influences the reliability of solder joints [ 26 , 27 , 28 ]. Therefore, the selection must comply with the following device operation.…”

Section: Introductionmentioning

confidence: 99%

Investigation of Impacts on Printed Circuit Board Laminated Composites Caused by Surface Finish Application

2021

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The purpose of this study was to compare the strength of the bond between resin and glass cloth for various composites (laminates) and its dependence on utilized soldering pad surface finishes. Moreover, the impact of surface finish application on the thermomechanical properties of the composites was evaluated. Three different laminates with various thermal endurances were included in the study. Soldering pads were covered with OSP and HASL surface finishes. The strength of the cohesion of the resin upper layer was examined utilizing a newly established method designed for pulling tests. Experiments studying the bond strength were performed at a selection of laminate temperatures. Changes in thermomechanical behavior were observed by thermomechanical and dynamic mechanical analyses. The results confirmed the influence of the type of laminate and used surface finish on bond strength. In particular, permanent polymer degradation caused by thermal shock during HASL application was observed in the least thermally resistant laminate. A response to thermal shock was detected in thermomechanical properties of other laminates as well, but it does not seem to be permanent.

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Effects of Surface Finish on the Shear Fatigue of SAC-Based Solder Alloys

Cited by 17 publications

References 36 publications

The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys

The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys

Study on Effects of Nonlinear Behavior Characteristics of Prepreg Dielectric on Warpage of Substrate under Laminating Process

Investigation of Impacts on Printed Circuit Board Laminated Composites Caused by Surface Finish Application

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