Effects of Surface Treatment on Adhesion of Silver Film on Glass Substrate Fabricated by Electroless Plating

Chitvoranund, Natechanok; Jiemsirilers, Sirithan; Kashima, Dujreutai Pongkao

doi:10.4028/www.scientific.net/amr.664.566

Cited by 20 publications

(21 citation statements)

References 16 publications

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“…In our implementation of the process, the substrates are placed in a BOE solution for 2 min, which etches channels into the substrate ≈1 μm deep. The resulting etched channels’ surfaces also facilitate increased adhesion of the subsequent electrolessly deposited Ag, as compared to non‐etched surfaces, because of increased roughness and silanol groups created on the glass . The electroless Ag deposition process utilizes Tollens’ reagent .…”

Section: Resultsmentioning

confidence: 99%

“…After UV exposure and development of the resist, a non‐water‐soluble random pattern of gaps/crackles in the resist under the cracked nail polish film remains. We then use buffered oxide etch (BOE) to etch the exposed glass under the gaps, thus creating channels in the substrate and increasing the adhesion of metal in the subsequent step, electroless deposition of Ag. The photoresist is then removed by lift‐off in acetone, yielding a connected network of Ag wires on glass.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

All‐Solution‐Processed, Scalable, Self‐Cracking Ag Network Transparent Conductor

Yang¹,

Merlo²,

Kong³

et al. 2017

Physica Status Solidi (a)

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A scalable and a fully solution-based method is developed to produce environmentally stable Ag micro/nanowire networks for transparent conductors. By applying a self-cracking, water-soluble acrylate copolymer film as a photoresist mask, the need for formal photomask fabrication and costly vacuum and lithographic facilities is obviated. Also, an increase in adhesion and a decrease in roughness of the metal networks is demonstrated by depositing metal into the regions created by the glass etch step. As a result, the networks can potentially be inexpensively scaled to large areas, as well as be flexible after removal from the substrate. They also exhibit record values of figures of merit that have been employed in the literature, offering a possibly excellent replacement for ITO.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

All‐Solution‐Processed, Scalable, Self‐Cracking Ag Network Transparent Conductor

Yang¹,

Merlo²,

Kong³

et al. 2017

Physica Status Solidi (a)

View full text Add to dashboard Cite

show abstract

“…Ag layers were formed very easily because the wetting-contact angle between two phases (substrate and solution) was greater than zero and reduced the energy needed. The Tollen's reaction occurred as a heterogeneous nucleation [48].…”

Section: Semmentioning

confidence: 99%

Green synthesis of dual-surface nanocomposite films using Tollen’s method

Badawy¹

2014

Green Processing and Synthesis

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Nanocomposite films with dual-surface, silver (Ag) layers and silver-polyvinyl alcohol (Ag-PVA) bulk layers were prepared by Tollen's reagent using β-D-glucose as a green reducing agent in water as an environmentallyfriendly solvent and in PVA as a bio-friendly polymer. The gradual color change of Ag in PVA solutions from colorless to light brown and then to brown, and finally dark brown, indicated the formation of Ag nanoparticles in the bulk of the PVA solution which finally formed Ag layers on the inner side of the glass. Energy dispersive X-ray (EDX) analysis and X-ray diffraction (XRD) were used to characterize the nanocomposite films with two surfaces. The Ag content of the Ag layers reached 93% with a higher crystallinity. The Ag content of the Ag-PVA bulk layers reached 10.8% with a lower crystallinity due to incorporation of Ag nanoparticles in the polymer chains. The structure and morphology of the two surfaces were confirmed by scanning electron microscopy (SEM).

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“…In addition to electrical conductivity, adhesion of printed lines or film to various substrates is another area of great interest (6)(7)(8)(9)(10)(11)(12)(13)(14). Various techniques for improving adhesion between printed material and substrate have been tested and reported.…”

mentioning

confidence: 99%

Effect of titania addition on adhesion of silver colloids to glass substrate

Lai

Chou

2015

The Journal of Adhesion

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The purpose of this study was to investigate the effects of titania addition on adhesion strength of silver colloids to glass substrate. Our results indicated that when the pH was adjusted to 10, the mixed slurry of titania and silver colloids was stable with no sign of settling at approximately 4 h. After film deposition by doctor blade method and subsequent sintering treatment, the adhesion strength between silver film and glass substrate was measured by both ASTM D3359 and D4541 standards. The results showed positive correlation of adhesion strength to both the titania concentration and sintering temperature.The adhesion strength reached 7.0 MPa when we added 8 wt% titania (based on silver) and sintered the film at 320 o C for 20 minutes. X-ray photoelectron spectroscopy data revealed that inter-diffusion of Ti into both glass substrate and silver colloid might be responsible for adhesion enhancement. On the other hand, the electrical resistivity of films increased with titania addition. This fact implied that we need to compromise between these two properties when titania addition was used to improve adhesion between silver colloid and glass substrate. An empirical model was subsequently proposed to simulate the compromise between adhesion strength and electrical resistivity.

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Effects of Surface Treatment on Adhesion of Silver Film on Glass Substrate Fabricated by Electroless Plating

Cited by 20 publications

References 16 publications

All‐Solution‐Processed, Scalable, Self‐Cracking Ag Network Transparent Conductor

All‐Solution‐Processed, Scalable, Self‐Cracking Ag Network Transparent Conductor

Green synthesis of dual-surface nanocomposite films using Tollen’s method

Effect of titania addition on adhesion of silver colloids to glass substrate

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